OPC correction method based on photoetching process window
A lithography process and lithography technology, applied to the original parts for photomechanical processing, photoplate process of pattern surface, optics, etc., can solve the difficulty of weight value selection, poor stability of lithography graphics, and OPC model low reliability issues
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[0015] In order to have a more specific understanding of the technical content, characteristics and effects of the present invention, the detailed description is as follows in conjunction with the illustrated embodiment:
[0016] The OPC correction method based on photolithography process window of the present invention, its objective function EPE final The value of the weight of each lithography model in the layout is not fixed for different graphics in the layout, but is set according to the characteristics of different graphics and the surrounding environment of the graphics. The weight setting method is through a certain functional form W i =f(x 1 , x 2 ,…) to control, where, x i MEEF (Mask Error Enhancement Factor, mask error enhancement factor), I max (maximum light intensity), I min (minimum value of light intensity) or Slope (slope), etc., x can also exist in the function i with x j A product term of .
[0017] Specifically, weights can be set through the follo...
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