Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Digital-controlled finished circuit board reliability quick evaluation method under combined effects of environment

A comprehensive and reliable technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve problems such as complex assignment of model variables, lack of accuracy, and unclear application objects

Active Publication Date: 2013-06-26
HUAZHONG UNIV OF SCI & TECH
View PDF5 Cites 27 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the current technology, the inherent acceleration models used in the accelerated life test of test samples usually include Arrhenius model, inverse power law model, Eyring model, etc. These existing models can quickly determine the acceleration factor and save time, but Usually only the influence of single stress is considered, and the application objects are not clear and diverse, and the accuracy is lacking, and the assignment of model variables is complicated

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Digital-controlled finished circuit board reliability quick evaluation method under combined effects of environment
  • Digital-controlled finished circuit board reliability quick evaluation method under combined effects of environment
  • Digital-controlled finished circuit board reliability quick evaluation method under combined effects of environment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] In a high-temperature and high-humidity environment, when a printed circuit board is applied with a working voltage, it is often found that the insulation resistance between two adjacent wires and holes drops sharply after a certain period of time. This phenomenon is mainly due to electrochemical migration ( ECM) phenomenon is caused. With the in-depth research on the failure mechanism analysis of printed circuit boards, it is shown that the ECM phenomenon is the main mode of performance degradation or even failure of printed circuit boards under the comprehensive environment of high tempera...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a digital-controlled finished circuit board reliability quick evaluation method under combined effects of environment. The digital-controlled finished circuit board reliability quick evaluation method includes (I) selecting temperatures and direct-current bias as accelerating stress, and building accelerating model for a circuit board to be evaluated; (II) determining accelerating stress level and stress combinatorial number, performing accelerating service life tests in groups, and recording test data; (III) selecting a service life distribution model, solving parameters according to the test data, and calculating characteristic service life values in varied combinations of accelerating stress; (IV) matching and determining model coefficients for the accelerating model of the circuit board according to the characteristic service life values, performing reliability evaluation, and obtaining reliability index of the digital-controlled finished circuit board under combined effects of environment. By the aid of the digital-controlled finished circuit board reliability quick evaluation method, the reliability index of the digital-controlled finished circuit board under combined effects of environment can be quickly and quantitatively determined, requirements of system reliability quick evaluation are met, the whole flow is convenient to operate and high in efficiency, and requirements of high reliability on a digital control system are met.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and more specifically relates to a method for rapidly evaluating the reliability of a digitally controlled finished circuit board under comprehensive environmental effects. Background technique [0002] Printed circuit boards are the main components of electronic products and are widely used in various fields such as aviation, numerical control, computers, and automation instruments. Considering that the quality performance and stability of printed circuit boards are crucial to products, environmental tests are often required during the manufacturing process to establish their reliability indicators. Environmental testing can be roughly divided into climate environmental testing, mechanical environmental testing and comprehensive environmental testing, among which climate environmental testing refers to placing the finished printed circuit board to be tested in different temperatur...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01R31/00G01N17/00
Inventor 金健解传宁凌文锋叶伯生唐小琦周向东张航军陈吉红
Owner HUAZHONG UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products