Method for setting exposure conditions in photoetching

Abstract

The invention provides a method for setting exposure conditions in photoetching, and belongs to the technical field of semiconductor photoetching. The method for setting exposure conditions in photoetching is applied to the first-time photoetching process of a photolithography mask used under a first process platform for the first time; and during a setting process, at least an initial exposure energy in the exposure conditions is correspondingly set according to the provider information of the photolithography mask. Therefore, the problem that the CD (compact disk) of a wafer exceeds the specific process specifications caused by no consideration for the provider difference factor of the photolithography mask is avoided, the yield of the first-time photoetching is increased, and the rework rate of the photoetching is greatly reduced.

Description

Technical field [0001] The present invention belongs to the technical field of semiconductor lithography, and relates to a method for setting exposure conditions in lithography, and in particular to a method for setting exposure conditions during the first lithography of a photolithography plate used for the first time under the same process platform. Taking into account the difference in the feature size (CD) of the wafer for the first lithography caused by the difference of the lithography plate suppliers. Background technique [0002] Photolithography is one of the main patterning methods in semiconductor manufacturing technology, in which the pattern is transferred to the photoresist of the wafer through a photolithography plate. Therefore, the photolithography plate is a common tool in the photolithography process. In the process of photolithography, the critical dimension (Critical Dimension, also known as "CD" or "feature line width") of the wafer formed by the photol...

AI Technical Summary

Problems solved by technology

[0005] However, chip manufacturers will choose multiple suppliers to supply lithography plates, especially for lithography plates of different products (one product corresponds to a set of lithography plates), even if it is completed under the same process platform, its lithography The suppliers of the photolithographic plates are usually different; at the same time, the CD testing equipment for the photolithographic plates produced by different suppliers is not matched or different from each other, even if the photolithography provided by each supplier corresponding to different products under the same process platform The CD of the lithographic plate is labeled as consistent, but in fact the CD of the lithographic plate is actually different, and this difference will be transmitted to the CD of the wafer to cause a difference

Images