Clean room for semiconductor plant

Abstract

The invention discloses a clean room for semiconductor plant. The clean room comprises a new wind conveying system, an exhausting system and a large clean space. The large clean space has a central aisle and at least a production aisle, wherein a clapboard is arranged around the production aisle, so that at least a part of the frame space, the clean space and the space where a raised floor locates form an independent clean micro-environmental structure. The distance between the bottom of the clapboard and the ceiling is at least 60 cm, and the distance between the bottom of the clapboard and the raised floor is at least 2m. An upper seal plate and a lower sealplate are respectively arranged on the top and the bottom of the clean micro-environment, and the breadth of the lower sealplate is smaller than the breadth of the upper sealplate. According to the clean room, the clapboards are arranged around the production aisle to form an independent clean micro-environmental structure, so that the effects on the storage and the products of the central aisle and the production aisle due to the corrosive gas are avoided.

Description

technical field [0001] The invention relates to a clean room used in a semiconductor workshop, in particular to a production occasion for high-end semiconductors. Background technique [0002] The semiconductor plant is a place specially used to prepare semiconductor devices, and it has been widely used at present. Due to the particularity of semiconductor devices, semiconductor plants must be designed as clean rooms to meet the requirements of constant temperature, humidity and cleanliness. For some high-end semiconductor production plants, such as 32 / 28nm and even below high-end processes, not only have higher requirements for cleanliness, but also have stricter pollution of suspended chemical molecules floating in the air. [0003] Existing cleanrooms for semiconductor fabs see attached Figure 1~3 As shown, it mainly includes a fresh air conveying system, an exhaust system and a large clean space in which various processing equipment are arranged, and a central corridor...

AI Technical Summary

Problems solved by technology

[0007] However, the above-mentioned technical solution has the following problems: (1) Since partitions are arranged around the production aisle, and there is a gap between the partitions and the placement area directly below them, the air damper is formed, that is, the partitions and the directly below The distance between the placement areas is very small, therefore, the partition separates the production aisle from the service area, hindering the movement of personnel; (2) due to the need to form gas between the partition and the placement area directly below Adjust the damper, so the distance between the partition and the raised floor is difficult to grasp. In the actual construction process, the partition is generally extended directly to the raised floor, and then part of the partition is cut off after the processing equipment comes in, so that the partition is in line with the raised floor. A gas adjustment damper is formed between the lower placement areas. Obviously, this method is time-consuming and laborious, and the cost is high

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