Method for forming sealed electrical feedthroughs through encapsulation package and elcapsulation package provided with at least one such electrical feedthrough
A package and feed-through technology, applied in the field of sealed closed package, cooling infrared radiation, electromagnetic radiation, can solve the problems of changing the sealing of the package, complicated implementation, weak connection, etc., to achieve the effect of increasing the size
Inactive Publication Date: 2013-07-17
法国红外探测器公司
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Problems solved by technology
However, this technique has the disadvantage of a relatively weak connection between the insert and the substrate
In fact, if pressure is unintentionally applied on one of the edges of the insert, this may tilt the insert relative to its bearing area on the side walls, creating the risk of altering the tightness of the resulting package
Additionally, implementation is further complicated by the need for metallization and brazing on the sides and surfaces of the ceramic insert
Method used
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[0036] Thus, a simplified cross-sectional view of a package according to the present invention is at Figure 5 shown in . The substrate 20 of the package is conventionally made of production. Substrate 20 passed also by The finished cover or closing frame 22 is closed, said cover being mounted on the free upper end of the side wall 21 of the base 20 by soldering or by laser welding.
[0037] The bottom of the package carries components 25 attached at this level by bonding or high temperature soldering, eg infrared detectors.
[0038] According to a characteristic of the invention, the bottom of the package is also pierced with a through-opening 31 .
[0039] The through-opening 31 is intended to be closed with a plate 30 made of co-fired ceramic of the HTCC type. The plate 30 is attached by brazing at the level of the side edge 32 defining the aforementioned through opening.
[0040] The width of the side edge 32 of the opening 31 of the base which defines the bottom an...
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The method involves forming a through opening (31) in one of walls (21) of an encapsulation package, and soldering a plate (30) made of cofired ceramic on the opening, where the cofired ceramic plate includes electric connections transiting through the plate. The through opening is formed in the bottom of the package, and the cofired ceramic plate is soldered face-to-face on bottom (20) of the package, where the package is made of ferrous-nickel-cobalt (FeNiCo) alloy. An independent claim is also included for an encapsulation package.
Description
technical field [0001] This disclosure is in the field of sealed encapsulation packages, more specifically in the field of detectors, in particular in the field of electromagnetic radiation, and more in particular in the field of cooled infrared radiation. Background technique [0002] In the field of infrared detection at low temperatures (that is to say, to realize quantum phenomena), the detector should be cooled to very low temperatures, usually in the range between 50K and 200K. [0003] For this purpose, such detectors are conventionally associated with cryostat housings (also known as cryostats), enabling, depending on the detector use temperature, The cryostat is cooled by means of a cold finger or again by means of a low temperature generator. [0004] Furthermore, the generator itself is usually enclosed in a hermetic enclosure under vacuum. [0005] One of the different difficulties encountered with this type of detector is that which arises from the need for an...
Claims
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IPC IPC(8): H01L21/60H01L21/56H01L23/488H01L23/31
CPCH01L23/047H05K13/0084H01L23/492H01L31/0203H01L31/02002H01L2224/48091H01L23/045H05K5/0217H01L2924/00014H01L23/48H01L25/065
Inventor 弗朗索瓦·科尔博
Owner 法国红外探测器公司