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Novel heat-dissipation material and preparation method thereof

A technology of heat-dissipating materials and nanomaterials, which is applied in the fields of polyurea/polyurethane coatings, coatings, dyed polymer organic compounds, etc., can solve the problems of easy aggregation of nano-heat-dissipating materials, affecting thermal conductivity, poor stability and compatibility, etc. , to achieve the effect of improving compatibility and system dispersion stability, improving interface performance, and excellent heat dissipation performance

Inactive Publication Date: 2013-07-24
SHENZHEN VKIRIN TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, heat dissipation fillers in heat dissipation coating materials on the market are mainly graphite, carbon nanotubes, etc.; however, the compatibility of the above heat dissipation fillers with polymer materials is poor, and nano heat dissipation materials are easy to aggregate, which seriously affects its thermal conductivity. effect and stability

Method used

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  • Novel heat-dissipation material and preparation method thereof
  • Novel heat-dissipation material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Under the protection of nitrogen, weigh 10g of 30-40nm hollow carbon nanospheres (HCNC) and place them in 50g of solvent water, sonicate at room temperature for 30min to disperse evenly; -10, then dropwise add 10g of modifying agent polyvinyl alcohol (Mw=2000) aqueous solution (concentration is 50wt%) at the speed of 3ml / min, continue ultrasonic 30min to disperse evenly after dropping; The heating rate is raised to 60°C, and the remaining 5g of the above modifier polyvinyl alcohol aqueous solution is added dropwise at a rate of 3ml / min during this process. When the temperature rises to 60°C, the dropwise addition is completed, and the reaction is performed at this temperature for 4h Then disperse for 60 minutes with an ultra-high pressure nano-homogenizer and disperse for 60 minutes with an ultrasonic wave to obtain a uniformly dispersed aqueous slurry of inorganic heat-dissipating nanomaterials.

Embodiment 2

[0047] Under the protection of nitrogen, weigh 10g of 10-30nm carbon nanotubes (product label: IMC4, the same below) and place them in 100g of solvent water, and ultrasonically disperse them at room temperature for 30min; then, under ultrasonic conditions, utilize 5% ammonia water Adjust the pH value to 8-10, then dropwise add 10g of modifier polyvinyl alcohol (Mw=2000) aqueous solution (concentration is 50wt%) at the speed of 4ml / min, continue ultrasonic 30min to disperse evenly after dropping; Raise the temperature to 50°C at a heating rate of 3°C / min, add the remaining 5g of the above-mentioned modifying agent polyvinyl alcohol aqueous solution dropwise at a speed of 4ml / min during this process, and complete the dropwise addition when the temperature rises to 50°C. React at high temperature for 6 hours, then disperse with ultra-high pressure nano homogenizer for 60 minutes, and disperse with ultrasonic for 60 minutes to obtain a uniformly dispersed aqueous slurry of inorgani...

Embodiment 3

[0049] Under the protection of nitrogen, weigh 25g of 30nm nano-aluminum nitride (product label: DK331, the same below) and place it in 75g of solvent water, and ultrasonicate at room temperature for 20min until the dispersion is uniform; pH value to 8, then dropwise add 12g of modifying agent polyacrylic acid (Mw=3000) aqueous solution (concentration is 50wt%) with the speed of 2ml / min, continue ultrasonic 15min to disperse evenly after dropping; The heating rate of min is raised to 60°C, and the remaining 6g of the above-mentioned modifier polyacrylic acid aqueous solution is added dropwise at a rate of 2ml / min during this process. When the temperature rises to 60°C, the dropwise addition is completed, and the reaction is carried out at this temperature for 3h Then disperse for 120 minutes with an ultra-high pressure nano-homogenizer and 90 minutes for ultrasonic dispersion to obtain a uniformly dispersed inorganic heat-dissipating nanomaterial water-based slurry.

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Abstract

The invention relates to inorganic heat-dissipation nano-material aqueous slurry and a novel heat-dissipation material containing the inorganic heat-dissipation nano-material aqueous slurry and a preparation method of the novel heat-dissipation material. The inorganic heat-dissipation nano-material aqueous slurry comprises, by weight, 10 to 25 parts of an inorganic heat-dissipation nano-material, 0.5 to 20 parts of a modifier or a modifier solution, and 50 to 100 parts of a solvent. The novel heat-dissipation material comprises, by weight, 10 to 30 parts of the inorganic heat-dissipation nano-material aqueous slurry, 40 to 80 parts of an aqueous polymer resin, 20 to 30 parts of latex, 10 to 40 parts of a film forming auxiliary agent, 0.5 to 5 parts of an auxiliary agent and 5 to 20 parts of a diluent. The novel heat-dissipation material has excellent heat-dissipation performances.

Description

technical field [0001] The invention relates to a novel heat dissipation material, in particular to a heat dissipation material containing an inorganic heat dissipation nanomaterial aqueous slurry and a preparation method of the heat dissipation material. Background technique [0002] Nowadays, the function of electronic equipment is more and more powerful, but the volume is getting smaller and smaller, which makes the heat dissipation problem a prominent problem that designers have to face. The original heat dissipation is just to install a few fans, open a few cooling holes or Adding some heat sinks is just enough, but it is not enough for today's small-sized, high-heating electrical appliances, and another way must be found. [0003] At present, there are mainly three kinds of heat dissipation materials, namely: thermal conductive silicone grease, heat dissipation graphite sheet, and inorganic nanoparticle-polymer composite heat dissipation material. Thermally conductive...

Claims

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Application Information

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IPC IPC(8): C08L33/00C08L25/14C08L75/04C08L33/04C08L83/04C08K9/04C08K7/24C08K7/00C08K3/04C08K3/28C08K3/08C08K3/22C09D133/00C09D125/14C09D175/04C09D133/04C09D183/04C09C3/10
Inventor 刘英博刘斌张开运宋占国刘畅
Owner SHENZHEN VKIRIN TECH DEV
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