Novel heat-dissipation material and preparation method thereof

A technology of heat-dissipating materials and nanomaterials, which is applied in the fields of polyurea/polyurethane coatings, coatings, dyed polymer organic compounds, etc., can solve the problems of easy aggregation of nano-heat-dissipating materials, affecting thermal conductivity, poor stability and compatibility, etc. , to achieve the effect of improving compatibility and system dispersion stability, improving interface performance, and excellent heat dissipation performance

Inactive Publication Date: 2013-07-24
SHENZHEN VKIRIN TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, heat dissipation fillers in heat dissipation coating materials on the market are mainly graphite, carbon nanotubes, etc.; however, the compatibility of the above heat d

Method used

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  • Novel heat-dissipation material and preparation method thereof
  • Novel heat-dissipation material and preparation method thereof
  • Novel heat-dissipation material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0044] Example 1:

[0045] Under the protection of nitrogen, weigh 10g of 30-40nm hollow carbon nanospheres (HCNC) into 50g of solvent water, sonicate for 30min at room temperature until the dispersion is uniform; then under the state of ultrasound, adjust the pH to 8 with 5% ammonia water -10, then add 10g of modifier polyvinyl alcohol (Mw=2000) aqueous solution (50wt%) dropwise at a speed of 3ml / min, and continue to sonicate for 30min until the dispersion is uniform after the addition is complete; then at 5℃ / min The temperature rise rate is raised to 60°C, during this process, the remaining 5g of the above-mentioned modifier polyvinyl alcohol aqueous solution is added dropwise at a rate of 3ml / min. When the temperature is raised to 60°C, the dropwise addition is completed, and the reaction is carried out at this temperature for 4h, Then the ultra-high pressure nano-homogenizer disperses for 60 minutes and ultrasonically disperses for 60 minutes to obtain a uniformly dispersed i...

Example Embodiment

[0046] Example 2

[0047] Under the protection of nitrogen, weigh 10g of 10-30nm carbon nanotubes (product number: IMC4, the same below), place them in 100g of solvent water, sonicate for 30min at room temperature until the dispersion is uniform; then use 5% ammonia water under ultrasonication Adjust the pH value to 8-10, then add 10g of modifier polyvinyl alcohol (Mw=2000) aqueous solution (concentration of 50wt%) at a rate of 4ml / min, and continue to sonicate for 30min until the dispersion is uniform after the addition is complete; The temperature is increased to 50°C at a temperature increase rate of 3°C / min. During this process, the remaining 5g of the above-mentioned modifier polyvinyl alcohol aqueous solution is added dropwise at a rate of 4ml / min. When the temperature is raised to 50°C, the dripping is completed. After reacting for 6 hours at a temperature, and then dispersing in an ultra-high pressure nano-homogenizer for 60 minutes and ultrasonically for 60 minutes, a un...

Example Embodiment

[0048] Example 3

[0049] Under the protection of nitrogen, weigh 25g of 30nm nano aluminum nitride (product number: DK331, the same below), place in 75g of solvent water, sonicate for 20min at room temperature until the dispersion is uniform; then under the ultrasonic state, adjust with 5% ammonia water The pH value reaches 8, then 12g of modifier polyacrylic acid (Mw=3000) aqueous solution (with a concentration of 50wt%) is added dropwise at a rate of 2ml / min, and after the addition is complete, ultrasonication is continued for 15min until the dispersion is uniform; then 3℃ / min. The temperature rise rate of min is increased to 60°C. During this process, the remaining 6g of the above-mentioned modifier polyacrylic acid aqueous solution is added dropwise at a rate of 2ml / min. When the temperature is raised to 60°C, the dropwise addition is completed. React at this temperature for 3h, Then the ultra-high pressure nano-homogenizer disperses for 120 minutes and ultrasonically disper...

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Abstract

The invention relates to inorganic heat-dissipation nano-material aqueous slurry and a novel heat-dissipation material containing the inorganic heat-dissipation nano-material aqueous slurry and a preparation method of the novel heat-dissipation material. The inorganic heat-dissipation nano-material aqueous slurry comprises, by weight, 10 to 25 parts of an inorganic heat-dissipation nano-material, 0.5 to 20 parts of a modifier or a modifier solution, and 50 to 100 parts of a solvent. The novel heat-dissipation material comprises, by weight, 10 to 30 parts of the inorganic heat-dissipation nano-material aqueous slurry, 40 to 80 parts of an aqueous polymer resin, 20 to 30 parts of latex, 10 to 40 parts of a film forming auxiliary agent, 0.5 to 5 parts of an auxiliary agent and 5 to 20 parts of a diluent. The novel heat-dissipation material has excellent heat-dissipation performances.

Description

technical field [0001] The invention relates to a novel heat dissipation material, in particular to a heat dissipation material containing an inorganic heat dissipation nanomaterial aqueous slurry and a preparation method of the heat dissipation material. Background technique [0002] Nowadays, the function of electronic equipment is more and more powerful, but the volume is getting smaller and smaller, which makes the heat dissipation problem a prominent problem that designers have to face. The original heat dissipation is just to install a few fans, open a few cooling holes or Adding some heat sinks is just enough, but it is not enough for today's small-sized, high-heating electrical appliances, and another way must be found. [0003] At present, there are mainly three kinds of heat dissipation materials, namely: thermal conductive silicone grease, heat dissipation graphite sheet, and inorganic nanoparticle-polymer composite heat dissipation material. Thermally conductive...

Claims

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Application Information

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IPC IPC(8): C08L33/00C08L25/14C08L75/04C08L33/04C08L83/04C08K9/04C08K7/24C08K7/00C08K3/04C08K3/28C08K3/08C08K3/22C09D133/00C09D125/14C09D175/04C09D133/04C09D183/04C09C3/10
Inventor 刘英博刘斌张开运宋占国刘畅
Owner SHENZHEN VKIRIN TECH DEV
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