Thermally conductive silicone composition and cured product thereof
A thermal conductivity and organosilicon technology, applied in the field of thermally conductive organosilicon compositions and their cured products, can solve problems such as disadvantages and achieve the effect of excellent processability
Active Publication Date: 2017-04-12
SHIN ETSU CHEM IND CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
A large amount of alumina filling is disadvantageous from the viewpoint of weight reduction
Method used
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Examples
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Comparison scheme
Effect test
Embodiment 1～3、 comparative example 1～3
[0177]In Examples 1 to 3 and Comparative Examples 1 to 3, the above-mentioned (A) to (G) components were used in the specified amounts shown in the following Table 1, and the composition was prepared as follows, and it was molded and cured according to the following The method is to measure or observe the viscosity of the composition, the thermal conductivity of the cured product, the hardness, the dielectric breakdown voltage, the specific gravity, and the wear of the reactor. Record the results together in Table 1.
[0178] [the preparation of the composition]
[0179] Add components (A), (C), (F), and (G) in the prescribed amounts shown in Examples 1 to 3 and Comparative Examples 1 to 3 in Table 1 below, and knead for 60 minutes with a planetary mixer .
[0180] Components (D) and (E) were added thereto in the prescribed amounts shown in Examples 1 to 3 and Comparative Examples 1 to 3 in Table 1 below, and further, as an internal additive for promoting release from the se...
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Abstract
The invention provides a heat conductive organic silicon composition and cured compound thereof, which are excellent in compression, insulation, heat conductivity and processing performances, have a heat conductivity over 3.0W / mK and are especially suitable for use as a heat radiating conductive resin forming body arranged between a heating component and a heat radiation component in an electronic device. The heat conductive organic silicon composition is characterized by containing (A) an organopolysiloxane having at least two alkenyls in one molecule, (B) an organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded with silicone atoms (C) heat conductive filling material, and (D) platinum group metal curing catalyst, wherein the (C) heat conductive filling material contains (C-i) amorphous alumina with an average particle diameter of 10-30 micrometers, (C-ii) spherical alumina with an average particle diameter of 30-85micrometers, (C-iii) specific amount of inorganic insulating filler with an average particle diameter of 0.1 -6 micrometers.
Description
technical field [0001] The present invention relates to a thermally conductive silicone composition that can be used as a thermally conductive material that exists between the thermal boundary surface of a heat-generating electronic component and the interface of a heat-radiating member such as a heat sink or a circuit board, especially for cooling electronic components using heat conduction and its solidification. Background technique [0002] LSI chips such as CPUs, driver ICs, and memories used in electronic devices such as personal computers, DVDs, and mobile phones generate a large amount of heat themselves due to high performance, high speed, small size, and high integration. The temperature rise of the chip causes malfunction and destruction of the chip. Therefore, a large number of heat dissipation methods and heat dissipation members used therein have been proposed for suppressing a temperature rise of an operating chip. [0003] Conventionally, in electronic devi...
Claims
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IPC IPC(8): C08L83/07C08L83/05C08L83/04C08K13/04C08K7/18C08K3/22C08K5/5419
Inventor 远藤晃洋樱井祐贵井川司丸山贵宏
Owner SHIN ETSU CHEM IND CO LTD