Rapid deposition process for combined-type spectrally selective absorption film layer
A technology of absorbing film layer and deposition process, which is applied in the field of solar thermal utilization, can solve the problems that the selective absorption of solar spectrum cannot be achieved, the proportion of components cannot be accurately controlled by air flow reactive sputtering, and the proportion is not easy to control.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0031] Example 1, a combined spectrally selective absorption film layer rapid deposition process, the combined spectrally selective absorption film layer is composed of an infrared reflective layer, an absorbing layer and an anti-reflection layer sequentially stacked from the inside to the outside; the deposition process uses The magnetron sputtering method is used to obtain the infrared reflection layer and the absorption layer respectively, and the anti-reflection layer is obtained by the hollow cathode gas flow sputtering method;
[0032] The infrared reflective layer adopts one of Ag, Ni, Cu and Al as a raw material, or two or more alloys of Ag, Ni, Cu and Al as a raw material;
[0033] The absorbing layer is composed of 2-4 sub-layers whose metal filling factors are changed sequentially, and each sub-layer adopts magnetron sputtering method to prepare metal filling element M+M oxide or M+M oxynitride to form a mixture ceramic dielectric film , wherein the metal filling fa...
Embodiment 2
[0035] Example 2, in the process described in Example 1: the oxide or oxynitride is Fe-O, Fe-ON, Cr-O, Cr-ON, Ni-O, Ni-ON, Ti-O , Ti-ON, Mn-O, Mn-ON, Sn-O, Sn-ON, Zn-O, ZnON, Mg-O, Mg-ON, Si-O, Si-ON, V-O, V-ON, Mo -O, Mo-ON, W-O, W-ON, Re-O, Re-ON, FeCr-O, FeCr-ON.
Embodiment 3
[0036] Embodiment 3, in the process described in embodiment 1 or 2: hollow cathode gas flow sputtering method deposits Al 2 o 3 In the anti-reflection layer, the vacuum degree is controlled at 100~10 -1 Pa, the sputtering power density is maintained at 0.5-100W / cm 2 , the flow rate of argon is 1000-10000 sccm, and the flow rate of oxygen is 10-200 sccm.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com