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Maskless local etching device, maskless local eteching method and maskless local eteching system

An etching device and a maskless technology, applied in the field of solar cells, can solve the problems of large environmental pollution of fluoride, high price, slow electron beam etching process, etc.

Active Publication Date: 2013-07-31
张陆成
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The main problems of the above traditional etching methods are: 1. Photolithography requires photoresist, which pollutes the environment more and costs more; 2. Plasma etching also needs a mask, and the generated fluoride and other waste gases Larger environmental pollution; 3. The electron beam etching process is very slow and expensive; 4. Laser etching has great damage to the etched material

Method used

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  • Maskless local etching device, maskless local eteching method and maskless local eteching system
  • Maskless local etching device, maskless local eteching method and maskless local eteching system
  • Maskless local etching device, maskless local eteching method and maskless local eteching system

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example 1

[0096] Example 1: Removal of solar battery front or back leakage

[0097] Leakage is a very serious electrical defect in solar cells. It can shunt the current generated by solar cells, reduce the fill factor, and reduce the conversion efficiency of the cells. Leakage can also generate hot spots and burn out solar cell components. Figure 4 It is a schematic diagram of the removal of solar cell leakage by maskless local etching method. For simplicity, Figure 4 The solar cell shown in includes an anti-reflection film 10, an emission region 11, a base region 12 and a back electrode 13, and the front electrode is not shown. Using the maskless local etching device of the present invention to remove the leakage method is not limited to Figure 4 The battery with this structure shown in the maskless local etching device can be used for all solar cells or semi-finished solar cells with p-n junctions or p-i-n junctions, and the removed leakage includes all short-circuit leakage due t...

example 2

[0103] Example 2: Component Etching

[0104] Figure 5 It is a schematic diagram of etching components using the maskless local etching device and method of the present invention. The component structure includes front surface glass 14 , EVA 15 , solar cell 16 , EVA 17 and back plate 18 . The components applicable to the maskless local etching device and method of the present invention include all components packaged with solar cells, wherein the solar cells include all solar cells with p-n junctions or p-i-n junctions. The maskless local etching device and method of the present invention can etch any material and solar cell in the solar cell module, and the position of the material to be etched in the module includes the position where hot spots, inclusions, and electrical connections come off.

[0105] Adopting the maskless local etching device of the present invention to etch components includes the following processes:

[0106] 1. Determine where to etch in the component...

example 3

[0110] Example 3: Solar cell through-hole process

[0111] In the solar cell process, the through-hole process is often used, that is, the starting silicon wafer or the semi-finished solar cell after one or more solar cell processes are opened in the direction perpendicular to the plane of the silicon wafer until completely Transparent. For example, during the process of emitter wrapping (Emitter Wrap Through-EWT) solar cells and metal wrapping (Metal Wrap Through-MWT) solar cells, it is necessary to use laser to prepare several holes from the front surface to the back surface. The maskless local etching device and method of the present invention can be used for the through-hole process before or after each process link of various solar cells including EWT and MWT solar cells. Or the thickness direction of the finished product is completely transparent.

[0112] The process steps for realizing the solar cell through hole by using the maskless local etching device of the pres...

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Abstract

The invention provides a maskless local etching device, a maskless local eteching method and a maskless local etching system. According to one aspect of the invention, the provided maskless local etching device comprises a fluid supply pipe, a fluid discharging pipe and a connecting pipe, wherein the fluid supply pipe provides a chemical reagent for a surface of an etched object; the fluid discharging pipe removes substances which are produced after the chemical reagent reacts with the etched object from the surface; and the connecting part is used for connecting the fluid supply pipe with the fluid discharging pipe in a relatively movable manner of the fluid supply pipe and the fluid discharging pipe.

Description

technical field [0001] The invention belongs to the technical field of solar cells, and in particular relates to a maskless local etching device, a maskless local etching method and a maskless local etching system. Background technique [0002] Localized etching (also known as localized corrosion or localized etching) is the use of chemical or physical methods to convert one or more layers of chemical composition or physical properties to one or more specific areas on the surface of a material. Different materials are removed to make the material form a specific space or / and material structure, so as to form a device with specific optical properties, electrical properties and / or optoelectronic properties. The existing local etching techniques mainly include the following types. [0003] A. Photolithography [0004] Photolithography is a kind of chemical etching with a mask. It first covers a layer of protective film, namely photoresist, on the surface of the material, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18
CPCY02P70/50
Inventor 张陆成
Owner 张陆成