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Laser boring method based on nanoscale particle flow

A laser drilling, nano-scale technology, applied in the field of microelectronics, can solve the problems of large surface roughness of the hole wall, which limits the development of laser drilling, etc., to achieve the effect of weakening the ablation strength, enhancing the strength of the hole wall, and not easy to crack

Active Publication Date: 2015-06-10
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there is a problem that the surface roughness of the hole wall is too large in the holes drilled by laser drilling, which limits the development of laser drilling.

Method used

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  • Laser boring method based on nanoscale particle flow

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Step 1: Focus the ultraviolet laser beam with a wavelength of 355nm-266nm on the drilled part of the crystalline silicon. Adjust the power density of the UV laser beam to 10 8 Wcm 2 , After the diameter is adjusted to 20um, focus on the center of the punched part.

[0021] Step 2: Flow a 0.6Mpa nano-scale inert nitrogen flow along the direction of the laser beam, so that the particle flow has sufficient speed to pass through the laser-drilled part.

[0022] A nanoscale inert nitrogen flow emission device is arranged on the outer circumference of the laser beam emission port, so that the nanoscale inert nitrogen flow covers the outer circumference of the laser beam. The particle flow takes away the heat and passivates the hole wall to form nitrides, which can enhance the strength of the hole wall, reduce the ablation strength of the hole wall that the laser has produced, and make the hole wall less likely to crack, making it smoother.

[0023] Step 3: Drill the hole w...

Embodiment 2

[0025] Step A: Focus the laser beam on the drilled part of the crystalline silicon.

[0026] Adjust the power density of the ultraviolet laser beam with a wavelength of 355nm-266nm to 10 8 Wcm 2 , After the diameter is adjusted to 20um, focus on the center of the punched part.

[0027] Step B: Flow through the 0.3Mpa nano-scale titanium particle flow along the direction of the laser beam. The particle flow takes away the heat and forms a metal film at the same time, thereby weakening the laser ablation of the hole wall and making the hole wall not easy to crack, so that it is more smooth. Specifically, a nanoscale titanium particle flow emitting device can be arranged on the outer circumference of the laser beam emission port, so that the nanoscale titanium particle flow covers the outside of the outer circumference of the laser beam.

[0028] Step C: Perforating the perforated part with a laser beam. The punching time is 0.001s.

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Abstract

The invention discloses a laser boring method based on a nanoscale particle flow. The method mainly solves the problem that a hole wall of a hole bored in the prior laser boring art is coarse. The method includes the following steps: (1) adjusting the power density of an ultraviolet light laser beam with wavelength as 355nm-266nm to be larger than 107Wcm<2> and accurately focusing the laser beam to a portion to be bored of a material to be bored; (2) enabling a nanoscale inertia particle flow of 0.6Mpa-1.0Mpa to flow past in the laser beam direction; and (3) boring the portion to be bored through the laser beam. Due to the fact that the nanoscale inertia particle flow is added in the laser boring process, the particle flow brings heat away and simultaneously passivates the hole wall, hole wall strength can be improved, erosion strength of laser on the hole wall of the bored hole is reduced, and the hole wall is not easy to collapse and becomes smooth.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and relates to the design of a semiconductor material and a preparation method thereof, in particular to a laser drilling method based on nanoscale particle flow. Background technique [0002] Laser drilling uses a laser beam as a heat source to melt and vaporize the material to be removed. The laser beam irradiates the perforated material to generate heat. The surface of the perforated material absorbs the heat and quickly transmits it to the inside of the material. The area irradiated by the laser will heat up rapidly. Due to the extremely short heating time, the surface layer of the perforated material will quickly melt and vaporize, and these vaporized gases will squeeze each other and start to spray outward, forming small pits. As the irradiation time increases, the degree of vaporization of the irradiated area increases sharply, and the air pressure in the pit also increases rapid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/144B23K26/382B23K101/40
Inventor 杨红艳赵永瑞王妍马洪波毕明路郑大安
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP