Composite substrate, manufacturing method and LED vertical chip structure based on the composite substrate
A technology of composite substrate and manufacturing method, which is applied in the direction of printed circuit manufacturing, circuit substrate materials, electrical components, etc., can solve problems such as poor heat dissipation, reduced lifespan, current congestion effect, etc., achieve excellent electrical and thermal conductivity and mechanical properties, and improve thermal conductivity , the effect of high thermal conductivity
Inactive Publication Date: 2016-06-08
XI AN JIAOTONG UNIV
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Problems solved by technology
Poor heat dissipation will cause the efficiency and performance of the LED to decline, and the lifespan will be reduced
Because traditional LEDs use sapphire as the substrate, and sapphire has poor electrical and thermal conductivity, it can only be made into the same-side electrode structure
LEDs with this structure, due to poor heat dissipation and current congestion effect, limit their application in high-power LEDs
Method used
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[0032] The present invention is described in further detail below in conjunction with accompanying drawing:
[0033] refer to figure 1 and figure 2 , the composite substrate of the present invention is composed of substrate and graphene in order from bottom to top. The substrate is a CuW, Mo, SiC or Si substrate; the thickness of the substrate is 100-400 μm. The number of layers of the graphene is 1-10 layers.
[0034] The manufacturing method of the composite substrate of the present invention is to grow graphene on the copper foil by CVD, and then transfer it to the substrate through the PDMS medium. Such as figure 1 As shown, the method specifically includes the following steps:
[0035] 1. Graphene growth on copper foil by CVD method
[0036] (1) Put the copper substrate into the hot furnace, pass H 2 , heated to 1000°C, H 2 The flow rate is 2 sccm, and the pressure in the furnace is 40 mTorr.
[0037] (2) Stabilize the copper substrate at 1000°C and pass CH 4 ,...
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Abstract
The invention discloses a composite substrate, a manufacturing method and an LED vertical chip structure based on the composite substrate. The composite substrate structurally comprises a substrate and graphene from bottom to top sequentially, wherein the substrate is a common substrate , such as CuW, SiC, Si, Mo and the like in an LED vertical chip. The composite substrate can be used as a bonding substrate in the manufacturing of the LED vertical chip and can bond the LED chip on a graphene layer. An LED adopting the composite substrate has better heat dissipation performance compared with that adopting the common use substrates of CuW, SiC and Si. Besides, the LED chip is bonded on the graphene layer of the composite substrate to form the LED vertical chip structure, so that the heat dissipation performance of the LED vertical chip structure can be improved effectively.
Description
technical field [0001] The invention belongs to the technical field of semiconductors, and relates to a composite substrate, in particular to a composite substrate for manufacturing LED vertical chips, a manufacturing method thereof, and an LED vertical chip structure based on the composite substrate. Background technique [0002] LEDs emit photons by spontaneous radiative recombination of carriers injected into the active region. They have the advantages of environmental protection and energy saving, long service life, and rich color gamut. Therefore, LEDs have broad application prospects in the fields of lighting, display screens, traffic lights, landscape lighting and LCD backlights. [0003] LEDs can only convert about 20% of the input power into light energy, while the remaining 80% is converted into heat energy. As the power increases, the problem of heat dissipation becomes more and more prominent. Poor heat dissipation will cause the efficiency and performance of t...
Claims
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IPC IPC(8): H05K1/03H05K3/00H01L33/54H01L33/64
Inventor 张景文布恩辉孟鹂李奉南宋继东候洵
Owner XI AN JIAOTONG UNIV