Highly thermally conductive resin cured product, highly thermally conductive semi-cured resin film, method of manufacturing same, and highly thermally conductive resin composition

Abstract

The invention provides a high-thermal conductivity resin cured product, a resin film and a resin composition with cured production with excellent thermal conductivity and voltage resistance. The high-thermal conductivity resin cured product comprises resin material of (A) component and filler of (B) component. The filler of the (B) component, with respect to its total mass, comprises: i) by mass, 15%-25% of small-grain size filler with the average grain size D50 ranging from 0.1 [mu]m to less than 1.0 [mu]m; ii) by mass, 15%-25% of middle-grain size filler with the average grain size D50 ranging from 3 [mu]m-20[mu]m; and iii) by mass, 50%-70% of large-grain size filler with the average grain size D50 ranging from 30 [mu]m-60[mu]m. Moreover, the greatest grain size of the filler is in the range of 30% to 70% with respect to the film thickness of the cured product, the average grain size of the large-grain size filler is in the range of 18% to 35% with respect to the film thickness of the cured product, and the content of the filler is in the range of 70vo1% to 90vol% of the integral composition.

Description

technical field [0001] The present invention relates to a highly thermally conductive resin cured product, a highly thermally conductive semi-cured resin film, and a highly thermally conductive resin composition for forming an insulating layer in, for example, a circuit board or an electronic component. Background technique [0002] In recent years, there has been an increasing demand for miniaturization and weight reduction of electronic equipment represented by mobile phones, LED lighting equipment, and related parts around automobile engines. Due to the miniaturization of electronic equipment and the increase in the integration level of circuits, in order to achieve high-speed information processing and high reliability, it is important to dissipate the heat generated in the equipment. In order to improve the heat dissipation characteristics of heat generated in electronic equipment, a technique of including a thermally conductive filler in an insulating layer constitutin...

AI Technical Summary

Problems solved by technology

However, when used as an insulating layer of an electronic device, if the film thickness of the insulating layer is reduced and the filling amount of the thermally conductive filler is increased, it becomes easy to form a leakage current (leakage current) path, thereby Causes a drop in withstand voltage characteristics

That is, in the insulating layer mixed with a thermally conductive filler used in electronic equipment, there is a so-called trade-off between the improvement of heat dissipation characteristics and the assurance of withstand voltage characteristics, and it is difficult to balance these two characteristics.

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