Manufacturing method of heat conduction light-emitting diode (LED) light bar package substrate comprising fluorescent powder
A technology for LED strips and packaging substrates, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as poor heat dissipation, single-sided light emission, etc., to increase heat dissipation performance, increase light output, and reduce process The effect of the process
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Embodiment 1
[0025] The high heat dissipation LED light bar of the present invention can be made according to the following methods:
[0026] Weigh 10g of YAG yellow fluorescent powder, 80g of alumina powder, and 10g of silica gel, put them into a glass beaker, then stir with a glass rod to make them fully mixed, and put the mixed materials into a die-casting mold for die-casting , the length, width, and height of the mold are 35*0.8*0.5mm, put the die-cast substrate into an oven at 150°C for baking, let it solidify, and then polish it to get the following: figure 1 substrate. Solder copper wires at both ends, and paste 30 blue LED chips on the polished substrate, such as figure 2 . Mix 4g of YAG yellow powder and 6g of silica gel evenly, apply the powder slurry to the substrate on the side of the solid crystal through an automatic dispenser, and put it in an oven for baking at 150°C to make it solidify, such as image 3 .
Embodiment 2
[0028] Weigh 9g of YAG yellow fluorescent powder, 1g of nitride red powder, 80g of alumina powder, and 10g of silica gel, put them into a glass beaker, then stir with a glass rod to make them fully mixed, and put the mixed materials into Die-casting is carried out in a die-casting mold. The length, width, and height of the mold are 35*0.8*0.5mm. The die-cast substrate is baked in an oven at 150°C to make it solidify, and then polished to obtain the following: figure 1 substrate. Solder copper wires at both ends, and paste 30 blue LED chips on the polished substrate, such as figure 2 . Mix 3.6g of YAG yellow powder, 0.4g of nitride red powder and 6g of silica gel evenly, apply the powder slurry to the substrate on the side of the solid crystal through an automatic dispenser, and put it in an oven for baking at 150°C to make it solidify, such as image 3 .
Embodiment 3
[0030] Weigh 10g of YAG yellow fluorescent powder, 80g of aluminum nitride powder, and 10g of silica gel, put them into a glass beaker, then stir with a glass rod to make them fully mixed, and put the mixed materials into a die-casting mold for For die-casting, the length, width, and height of the mold are 35*0.8*0.5mm. Put the die-cast substrate into an oven at 150°C for baking to make it solidify, and then polish it to obtain the following: figure 1 substrate. Solder copper wires at both ends, and paste 30 blue LED chips on the polished substrate, such as figure 2 . Mix 4g of YAG yellow powder and 6g of silica gel evenly, apply the powder slurry to the substrate on the side of the solid crystal through an automatic dispenser, and put it in an oven for baking at 150°C to make it solidify, such as image 3 .
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