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Method for manufacturing a flexible electronic device using a roll-shaped motherboard, flexible electronic device, and flexible substrate

A technology of flexible electronic devices and flexible substrates, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, electrical components, etc., can solve problems such as inability to use, reduce economy, weak interface adhesion, etc., achieve low cost, improve Economy, the effect of improving production speed and economy

Inactive Publication Date: 2013-09-11
POHANG IRON & STEEL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has the following disadvantages: since the temporary substrate is pasted on the thin-film device and then removed, the interface adhesion is weak, and it cannot be applied to organic electronic devices such as OLEDs that are poorly resistant to moisture or solvents
However, when the surface roughness is reduced by using a polymer series, there is a problem that the same high-temperature process as the above-mentioned plastic substrate process cannot be used. When the grinding process is used, it is suitable for the production of high-cost micro-processes using single-crystal Si substrates. In the case of devices or RAM, there is a problem of greatly reducing the economy when used on flexible electronic devices that require relatively low prices and large areas.

Method used

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  • Method for manufacturing a flexible electronic device using a roll-shaped motherboard, flexible electronic device, and flexible substrate
  • Method for manufacturing a flexible electronic device using a roll-shaped motherboard, flexible electronic device, and flexible substrate
  • Method for manufacturing a flexible electronic device using a roll-shaped motherboard, flexible electronic device, and flexible substrate

Examples

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no. 1 example ）

[0058] Figure 1 to Figure 5 The manufacturing method of the flexible electronic device according to the first embodiment of the present invention is schematically shown.

[0059] Such as Figure 1 to Figure 5 As shown, the method for manufacturing a flexible electronic device according to the first embodiment of the present invention generally includes: forming a flexible substrate 200 on a roll-shaped mother substrate 100 ( figure 1 A1 and figure 2 ), and the step of manufacturing a flexible substrate by separating the flexible substrate 200 from the roll-shaped mother substrate 100 ( figure 1 B1 and image 3 , figure 1 C1 and Figure 4 ); the step of forming the electronic device 300 and the sealing layer 400 on the separated surface of the separated flexible substrate 200 ( Figure 5 ).

[0060] In the first embodiment of the present invention, the roll-shaped mother substrate 100 uses mirror-finished surface roughness R ms p-vA stainless steel rod of <1000 nm wa...

no. 2 example ）

[0063] Such as Figure 6 to Figure 8 As shown, the second embodiment of the present invention manufactures the flexible substrate 200 by a method of forming the peeling layer 500 between the roll-shaped mother substrate 100 and the flexible substrate 200 differently from the first embodiment. When the peeling layer 500 is thus formed, the separated state of the flexible substrate 200 may be: as Image 6 As shown, separated from the flexible substrate 200 interface; or as Figure 7 As shown, the interface of the roll-shaped mother substrate 100 and the release layer 500 is separated; or as Figure 8 As shown, the inner surface of the release layer 500 is separated. At this time, at Image 6 In the case of the following process may not be required, but in Figure 7 with Figure 8 In this case, an additional process of removing the peeling layer 500 is required.

[0064] Like the first embodiment of the present invention, as the separation method between the roll-shaped mot...

no. 3 example ）

[0067] Figure 9 to Figure 14 A schematic representation of a method for manufacturing a flexible electronic device according to a third embodiment of the present invention.

[0068] Such as Figure 9 to Figure 14 As shown, the method for manufacturing a flexible electronic device according to the third embodiment of the present invention includes the following steps, forming a flexible substrate 200 on a roll-shaped mother substrate 100 by vapor deposition ( Figure 9 A2 and Figure 10 ) After that, the temporary substrate 600 is attached to the flexible substrate 200 by sandwiching the adhesive layer 700 thereon ( Figure 9 B2 and Figure 11 , Figure 9 C2 and Figure 12 ), and then separate the roll-shaped master substrate 100 formed on the flexible substrate 200 ( Figure 9 D2 and Figure 13 ), and then form the electronic device 300 and the sealing layer 400 on the separation surface of the flexible substrate 200, thereby manufacturing the step of the flexible elec...

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Abstract

The objective of the present invention is to solve the problems of degraded performance and yield of a flexible electronic device due to low processable temperature, high surface roughness, high thermal expansion coefficient, and poor handling characteristics of existing flexible substrates. The method for manufacturing a flexible electronic device according to the present invention comprises the steps of: forming a flexible substrate on a roll-shaped motherboard; separating the flexible substrate from the roll-shaped motherboard; and forming an electronic device on a separated surface of the flexible substrate that contacted the motherboard.

Description

technical field [0001] The present invention relates to a method for manufacturing a flexible electronic device, a flexible electronic device manufactured by the method, and a flexible substrate for the flexible electronic device. In more detail, it relates to a high Process temperature, and a flexible electronic device with a new structure of a flexible substrate having low surface roughness, low thermal expansion coefficient, and excellent operating characteristics, and a manufacturing method thereof. Background technique [0002] In recent years, along with the development of multimedia, the importance of flexible electronic devices has also increased. Therefore, it is necessary to manufacture organic light emitting diodes (organic light emitting display: OLED), liquid crystal display (liquid crystal display: LCD), electrophoretic display (Electrophoretic display: EPD), plasma display panel (plasma display) on a flexible substrate. display panel: PDP), thin-film transist...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56G02F1/1333G02F1/167H01L29/786
CPCG02F1/133305H01L27/1218H01L27/1266H01L29/78603Y02E10/549Y02P70/50H10K71/80H05K1/0277H10K77/111
Inventor 李钟览金基洙
Owner POHANG IRON & STEEL CO LTD
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