Packaging piece based on substrate and adopting liquid plastic packaging and manufacturing process of packaging piece
A packaging and liquid technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of low product packaging quality and poor circuit
Inactive Publication Date: 2013-09-25
HUATIAN TECH XIAN
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Problems solved by technology
[0006] Aiming at the above-mentioned defects of EPBGA, the present invention provides a package based on the substrate using liquid plastic packaging and its manufacturing process. The IC chip is first slotted in the packaging process, and the chip is directly attached to the copper plate through the slot, and its heat dissipation performance is extremely high. Good, improve its electrothermal performance; different from the previous plastic packaging process after slotting, use liquid plastic packaging compound to package the chip and bonding wire, avoiding the defects of poor circuit caused by solid plastic packaging material and low product packaging quality rate
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[0017] The present invention will be further described below in conjunction with the accompanying drawings.
[0018] Such as Figure 6 As shown, a package based on a substrate and adopting liquid plastic encapsulation is mainly composed of a lead frame 1 , a PAD 2 , solder balls 3 , conductive glue 4 , a chip 5 , a bonding wire 6 and a plastic encapsulant 7 . There are PAD2 and solder ball 3 on the lead frame 1, and there is a notch, the lead frame 1 is connected with a chip 5 in the notch through the conductive glue 4, and the solder joint on the chip 5 is bonded to the PAD2 on the lead frame 1 The wire 6 is connected, the chip 5, the bonding wire 6, the solder ball 3, and the lead frame 1 constitute the power supply and signal channel of the circuit, and the plastic package 7 surrounds the lead frame 1, PAD2, solder ball 3, chip 5 and bonding wire 6 , the plastic package 7 supports and protects the chip 5 , the bonding wire 6 and the solder ball 3 .
[0019] The plastic pa...
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The invention provides a packaging piece based on a substrate and adopting liquid plastic packaging and a manufacturing process of the packaging piece. The packaging piece is mainly composed of a lead frame, a PAD, a solder ball, conducting adhesive, a chip, a bonding wire and a plastic package body. The PAD and the solder ball are arranged on the lead frame, and a notch is formed in the lead frame. The chip is connected into the notch of the lead frame through the conducting adhesive, and welding spots on the chip are connected with the PAD on the lead frame through the bonding wire. The chip, the bonding wire, the solder ball and the lead frame form a power and signal channel of a circuit. The plastic package body wraps the lead frame, the PAD, the solder ball, the chip and the bonding wire. The plastic packing body is in liquid plastic packaging. The procedures of the manufacturing process are wafer thinning, scribing, substrate slotting and ball replacing, chip installing, installed chip baking, bonding, plasma cleaning, post curing, liquid plastic packaging and product finishing. According to the packaging piece based on the substrate and adopting the liquid plastic packaging and the manufacturing process of the packaging piece, the excellent rate of product packaging is improved.
Description
[0001] technical field [0002] The invention belongs to the technical field of integrated circuit packaging, and in particular relates to a liquid-plastic-sealed package based on a substrate and a manufacturing process thereof. Background technique [0003] The full name of EPBGA is Enhanced Plastic Ball Grid Array (Enhanced Heat Dissipation Ball Grid Array Package), which is a reverse packaging method in which integrated circuits use organic substrates + all-metal heat sinks. It has the following characteristics: ①The package area is much smaller than the ceramic package; ②The area of the heat sink is large, and the heat dissipation performance is very good, which is suitable for VLSI; ③The PCB board can be self-centered when soldering, and it is easy to tin; ④Light weight, reliability High; ⑤ good electrical performance, low overall cost. [0004] The I / O terminals of the BGA package are distributed under the package in the form of circular or columnar solder joints in...
Claims
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IPC IPC(8): H01L23/13H01L23/29H01L21/56H01L21/50
CPCH01L2224/48091
Inventor 贾文平谢建友王昕捷张园黄志永崔梦
Owner HUATIAN TECH XIAN