SRAM power source on FPGA chip

Abstract

The invention discloses an SRAM power source on an FPGA chip. The SRAM power source on the FPGA chip comprises a reference voltage circuit which is used for providing 1.2V and 1.8V double-reference voltages, a voltage detector which is used for detecting the voltage value of the SRAM power source and the 1.2V reference voltages and generating digital logic output, a voltage comparator which is used for restraining or compensating the voltages of the SRAM power source and improving the driving capacity of the voltages of the SRAM power source, an annular oscillator which is used for generating effective VCLK clock signals of the output voltages of a voltage pump, and a charge pump which is used for providing 3.3V power support for a full-chip SRAM unit. The reference voltage circuit is connected with the voltage detector, the voltage detector is connected with the annular oscillator and the SRAM unit, the voltage comparator is connected with the charge pump, the annular oscillator is connected with the charge pump, and the charge pump provides work power for the SRAM unit. The SRAM power source on the FPGA chip can lower the dynamic switch power consumption and the static direct current power of an SRAM memory on the FPGA chip.

Description

technical field [0001] The invention relates to the field of microelectronics, in particular to an FPGA-on-chip SRAM power supply. Background technique [0002] The problem of power dissipation in integrated circuits is a thermal problem. So all problems related to heat may lead to changes in chip power consumption. But in the natural environment, heat problem is one of the most common phenomena. These problems also exist for semiconductor integrated circuits. Energy in nature is always being transformed. After the chip is powered on, a lot of electric energy has to be converted into heat energy. For relatively small chips, this converted energy will not cause fatal damage to the chip. But for large-scale chips, such as CPU, GPU, FPGA, the problem of excessive power consumption is inevitable, and the huge heat will cause serious and irreversible damage to the chip. Moreover, with the continuous advancement of semiconductor process technology and the continuous reduction...

AI Technical Summary

Problems solved by technology

Without an accurate thermal analysis, the increase in heat can easily exceed the maximum allowable junction temperature, causing irreversible damage to the chip

Images