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LED device based on glass substrate and preparation method of LED device

A technology for LED devices and glass substrates, applied in the field of lighting, can solve the problems of poor thermal conductivity, cracking, and poor heat resistance of glass substrates, achieve good adhesion and electrical conductivity, reduce heat generation, and improve the effect of thermal conductivity.

Inactive Publication Date: 2013-10-09
苏州热驰光电科技有限公司 +1
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Problems solved by technology

At present, there is no LED circuit board using glass substrate, the reason is that the glass substrate has poor thermal conductivity, poor heat resistance and cannot directly complete the circuit board process on the glass substrate.
And once the glass substrate is overheated, there is a risk of cracking

Method used

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  • LED device based on glass substrate and preparation method of LED device

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Embodiment Construction

[0026] Diamond-like Carbon coating (Diamond-like Carbon), or DLC coating for short, is a diamond-like structure containing sp 3 bond and graphitic structure sp 2 bonded metastable amorphous material. Due to its own characteristics, DLC coating has many excellent properties, such as high hardness, high wear resistance, stable chemical properties, high photoluminescence rate and high electroluminescence rate, and excellent heat conversion efficiency and thermal conductivity.

[0027] In coating technology, physical vapor deposition refers to the process of evaporation, ionization or sputtering to produce metal particles and react with reactive gases to form compounds deposited on the surface of the workpiece, referred to as PVD. At present, the commonly used PVD coating technology is mainly divided into three categories, which are vacuum evaporation coating technology, vacuum sputtering coating technology and vacuum ion beam coating technology. Among them, the vacuum magnetron...

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Abstract

The invention provides an LED device based on a glass substrate and a preparation method of the LED device. The device comprises the glass substrate. A DLC coating on the glass substrate is prepared through a vapor deposition technology, an LED chip and electrodes are arranged above the DLC coating, and the LED chip and the electrodes are electrically communicated through wires. The LED device based on the glass substrate and the preparation method of the LED device have the advantages that common glass is used as the substrate of an LED circuit board, completely circumferential light emission of a light source can be achieved, the defect that due to the fact that a traditional substrate is light tight, the light source can only emit light within the angle of 180 degrees is overcome, the light can be fully utilized, and heat generation is reduced. By the adoption of the vapor deposition technology for manufacturing circuits on the glass substrate, the good adhesiveness and conduction characteristics of the circuits are ensured, and meanwhile due to the fact that a layer of diamond-like materials is deposited on the glass substrate, the heat transmission capacity of the LED circuit board is greatly improved.

Description

technical field [0001] The invention relates to an LED device, in particular to an LED device using a glass substrate and a preparation method thereof, belonging to the technical field of lighting. Background technique [0002] LED is a solid-state semiconductor lighting technology, and the process of realizing lighting must be realized by fixing LED chips on circuit boards. The materials of LED circuit boards are currently metal-based (aluminum, copper, etc.), resin-based (FR4, PI, etc.), ceramic-based (alumina, aluminum nitride, etc.), most of these materials are due to their good insulation and thermal conductivity. And be used for purposes. At present, no LED circuit board uses a glass substrate, because the glass substrate has poor thermal conductivity, poor heat resistance, and cannot directly complete the circuit board process on the glass substrate. And once the glass substrate is overheated, there is a risk of cracking. Contents of the invention [0003] The ob...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62H01L33/64
Inventor 钱涛孙明
Owner 苏州热驰光电科技有限公司
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