Method and system for scribing brittle ultrathin piece by water jet and laser

A technology for laser scribing and brittle materials, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of expensive micro-jet laser equipment, difficult to obtain production materials, and high equipment maintenance costs, and achieve optimal planning. Improve chip surface quality, improve scribing yield, eliminate residual stress and micro-cracks

CN103358028AInactive Publication Date: 2013-10-23GUILIN UNIV OF ELECTRONIC TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2013-10-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a method and system for scribing a brittle ultrathin piece by a water jet and laser. According to the method, a laser beam penetrates through a water jet beam to focus on the surface of a workpiece; the distance between the center of the jet point, on the surface of the workpiece, of the water jet beam and the center of the focus point, on the surface of the workpiece, of the laser beam is equal to or smaller than 1-2.5 times the radius of the focus point, on the surface of the workpiece, of the laser beam. The distance between an intersection point I and an intersection point II is equal to or smaller than 1-2.5 times the radius of the focus point of the laser beam, wherein the intersection point I is the intersection point of the surface of the workpiece and the water jet beam generated by the jet nozzle of the system, and the intersection point II is the intersection point of the surface of the workpiece and the laser beam. The longitudinal center line of the jet nozzle coincides with the center line of the laser beam. A workbench is provided with a working cavity filled with water; a water layer with a thickness of 0.5-1.5 mm is arranged on the surface of the workpiece on the top surface of a boss at the top of the workbench; the overflow port of the working cavity is connected to a water tank; a water pump is used for pumping water in the water tank into the jet nozzle to generate the water jet. According to the invention, the laser is used for laser ablating and scribing, and the water jet beam is used for cooling and washing a processed area, so that the effect that a processed surface is free from recast layers, residual stress and micro cracks is achieved; the processing efficiency is improved.
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Description

technical field

[0001] The invention relates to the technical field of laser processing, in particular to a method and system for marking ultra-thin sheets of brittle materials with water jet laser. Background technique

[0002] For electronic products, the market trend of "light, thin, short, and small" has changed the packaging of integrated circuits from a single chip to a stacked package of multi-layer chips. 7-8 layers of chips are superimposed in an IC, and the total volume after packaging is reduced to a fraction of the previous single-layer chip IC. Therefore, the thickness of the silicon wafer has also been reduced from 650 μm to 120 μm, and the lowest has reached 25 μm. Before the silicon wafer is diced, the whole wafer is processed, and after dicing, the single chip used in the IC packaging process is obtained. Due to the increase in wafer diameter and thinning in thickness, the tensile and extrusion strength of the wafer is getting weaker and weaker, and it is ...

Examples

Embodiment 1

[0031] The structure of Example 1 of the system for marking ultra-thin sheets of brittle materials by water jet laser is as follows figure 1 As shown, it includes a laser control unit, a pulse laser, a focusing lens and a jet nozzle. The laser control unit 1 is connected to and controls the pulse laser 2. The laser beam emitted by the pulse laser 2 is changed in direction by the mirror 3 and then focused on the workpiece by the focus lens 4. 6 surfaces. There is a working chamber 7 equipped with water above the workbench 8. The workbench 8 has a boss located in the workchamber 7. The workpiece 6 is fixed on the boss of the workbench 8. The surface of the workpiece 6 on the boss of the workbench 8 is lower than the work chamber. 7. The surface of the inner water is 0.5-1.5mm, that is, there is a water layer of 0.5-1.5mm on the surface of the workpiece 6. The working cavity 7 has an overflow port, and the lowest point of the overflow port is 0.5-1.5 mm higher than the surface o...

Embodiment 2

[0038] The structure of Example 2 of the system for marking ultra-thin sheets of brittle materials by water jet laser is as follows figure 2 As shown, the longitudinal centerline of the jet nozzle 5 of this example coincides with the centerline of the laser beam, and the laser beam passes through the focusing lens 4, passes through the nozzle hole of the jet nozzle 5, and then passes through the water jet to focus on the surface of the workpiece 6. The center of the focal point on the surface of 6 coincides with the center of the injection point of the water jet beam on the surface of the workpiece 6 . Cooling and flushing are better accomplished with water jets.

[0039] The jet nozzle 5 orifice diameter of this example is 3mm.

[0040] The water of this example water jet is distilled water.

[0041] The water jet laser engraving method for brittle material ultra-thin sheets in this example is that the center line of the water jet beam coincides with the center line of the...