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Resin composition and laminated body

A technology of resin composition and laminates, applied in the direction of synthetic resin layered products, layered products, packaged article types, etc. Excellent lamination formability, good bondability, and the effect of good bondability

Active Publication Date: 2013-10-30
MITSUBISHI RAYON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in extrusion lamination molding, molten adhesive resin, etc. are laminated at high speed on the surface of a film-formed base layer, so the joint strength between the two layers is not necessarily high.
As a result, the resulting laminate had problems such as peeling at the interface between the base material layer and the adhesive resin layer.
In particular, long-term storage of laminates obtained by extrusion lamination will cause the following problems: the bonding strength between the two layers will decrease over time due to the influence of temperature or humidity rise, etc.
[0005] In order to improve the adhesiveness between the base material layer and the adhesive resin layer, it is necessary to lower the extrusion speed during extrusion lamination molding, which greatly impairs the high-speed moldability that is originally a feature of extrusion lamination molding.

Method used

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  • Resin composition and laminated body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0189] 9.0% by weight of a-1, 21.0% by weight of b-1, 35.0% by weight of B-3, 20.0% by weight of C-1 and 15.0% by weight of D-1 (total 100% by weight) were previously dry-blended Mixing, using a twin-screw extruder PCM45 manufactured by Ikegai Seisakusho, melted and kneaded at a temperature of 200°C, a screw rotation speed of 300rpm, and an extrusion rate of 25kg / hr, extruded into a strip shape, and cooled Then, cutting was performed to obtain a granular resin composition.

Embodiment 2～7 and comparative example 1～5

[0191] A resin composition was obtained by melt-kneading in the same manner as in Example 1 except that the raw materials and their compounding ratios were shown in Table-1. However, in Example 3 and Example 6, in addition to the various materials in Table-1, 0.1% by weight of DHT4A (hydrotalcites produced by Kyowa Chemical Industry Co., Ltd.) was added to the total amount of 100% by weight. compound).

[0192]

[0193] Using random polypropylene as the outer layer, using the resin compositions obtained in Examples 1 to 7 and Comparative Examples 1 to 5 above as the inner layer (bonding material layer), an outer layer with a diameter of 20 μm was obtained by the following molding method: , A laminated body for evaluation of bonding strength composed of an inner layer of 10 μm.

[0194]

[0195] Molding machine: 2 types of two-layer co-extrusion lamination machines manufactured by Sumitomo Heavy Industries Modern

[0196] (The extruders are all single-screw extruders)

...

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Abstract

The purpose of the present invention is to provide a resin composition that can maintain adhesiveness well and has excellent high-speed extrusion lamination molding properties, and to provide a laminated body including a layer made of this resin composition. The present invention relates to a resin composition comprising (A) a polypropylene resin containing modified polypropylene made by modifying polypropylene with an unsaturated carboxylic acid or a derivative thereof, (B) a propylene copolymer, (C) an ethylene-a-olefin copolymer, and (D) polyethylene, and also relates to a laminated body containing a layer made of this resin composition.

Description

technical field [0001] The present invention relates to a resin composition which is excellent in formability in single-layer or multi-layer lamination molding and has good adhesion (adhesion) to metal and resin, and a laminate using the resin composition . [0002] More specifically, the present invention relates to a resin composition having good adhesion to aluminum and a resin film, and a laminate using the resin composition. Background technique [0003] A laminate in which an adhesive resin layer is laminated on a base layer is widely used as a packaging material for contents such as foods and pharmaceuticals where quality maintenance is important. As the substrate layer of the laminate used in these applications, when barrier properties (oxygen barrier properties, water vapor barrier properties, etc.) and light-shielding properties are required for packaging materials, a metal layer is used as the substrate layer. In addition, when barrier properties and transparenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/10B32B15/085B32B27/32C08K5/09C08L23/04
CPCB32B15/085C08K5/09C08L23/142B32B27/32B32B7/12B32B15/20B32B2270/00B32B2307/3065B32B2307/4026B32B2307/712B32B2439/70B32B2439/80C08L51/06C08L2205/025C08L2205/035C08L2207/066C08L23/12C08L23/0815C08L23/06
Inventor 山口辰夫二村达夫黑濑翔平
Owner MITSUBISHI RAYON CO LTD
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