Production process for improving blind routing depth accuracy

A technology of depth accuracy and production process, which is applied in the electronic field, can solve the problems of inability to meet the depth accuracy requirements of blind fishing, increase equipment cost and production cost, and unstable process capability, so as to save equipment cost, low production cost, and process stable effect

Active Publication Date: 2013-11-20
GULTECH WUXI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, ordinary molding equipment cannot meet the depth accuracy requirements of blind fishing processing, and special equipment is required to control the production, which increases equipment

Method used

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  • Production process for improving blind routing depth accuracy
  • Production process for improving blind routing depth accuracy
  • Production process for improving blind routing depth accuracy

Examples

Experimental program
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Example Embodiment

[0023] The present invention mainly includes the following steps: Figure 1~4 As shown, the first embodiment includes the following steps:

[0024] (1). First substrate etching: Drill a 3.175mm first positioning hole 4 on the first substrate 1 with a thickness of 1mm, and then perform an etching pattern 7 on the double copper foil surface, spray with acid etching solution, and purchase acid etching solution From Youyuan Chemical Co., Ltd., the model is cc-28, the composition of acid etching potion is: HC1 concentration is 1.2mol / l, NaCIO 3 The concentration is 15g / l, C U 2+ The concentration is 95g / l, the acid etching solution is water, the etching temperature is 45°C, the spray pressure is 1.4kg / c㎡, and the speed is 3m / min;

[0025] (2) Second and third substrate etching: etching the copper foil on one side of the second substrate 2 and the third substrate 3, remove the copper foil on one side of the second substrate 2 and the third substrate 3, and spray with acid etching solutio...

Example Embodiment

[0031] The second embodiment includes the following steps:

[0032] (1). First substrate etching: Drill a 3.175mm first positioning hole 4 on the first substrate 1 with a thickness of 2mm, and then perform pattern etching on the double copper foil surface, spray with acid etching solution, which is purchased from Youyuan Chemical Co., Ltd., model cc-28, composition of acid etching potion: HC1 concentration of 1.6mol / l, NaCIO 3 The concentration is 33g / l, C U 2+ The concentration is 118g / l, the acid etching solution is water, the etching temperature is 50℃, the spray pressure is 2.2kg / c㎡, and the speed is 3m / min;

[0033] (2) Second and third substrate etching: etching the copper foil on one side of the second substrate 2 and the third substrate 3, remove the copper foil on one side of the second substrate 2 and the third substrate 3, and spray with acid etching solution , The acid etching potion becomes: HC1 concentration is 1.6mol / l, NaCIO 3 The concentration is 33g / l, C U 2+ The ...

Example Embodiment

[0039] The third embodiment includes the following steps:

[0040] (1). First substrate etching: Drill a 3.175mm first positioning hole 4 on the first substrate 1 with a thickness of 1.5mm, then perform pattern etching on the double copper foil surface, spray with acid etching solution, and purchase acid etching solution From Youyuan Chemical Co., Ltd., the model is cc-28, the composition of the acid etching potion is: HC1 concentration is 2mol / l, NaCIO 3 The concentration is 50g / l, C U 2+ The concentration is 140g / l, the rest of the acid etching solution is water, the etching temperature is 55°C, the spray pressure is 3kg / c㎡, and the speed is 3m / min;

[0041] (2) Second and third substrate etching: etching the copper foil on one side of the second substrate 2 and the third substrate 3, remove the copper foil on one side of the second substrate 2 and the third substrate 3, and spray with acid etching solution , The acid etching potion becomes: HC1 concentration is 2mol / l, NaCIO 3 T...

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Abstract

The invention relates to a production process for improving blind routing depth accuracy, in particular to a method for improving the depth accuracy of a blind routing area on a printed circuit board and meeting the requirement of a customer on the high depth accuracy of the blind routing area, belonging to the field of electronic techniques. A first substrate, a second substrate and a third substrate are double-side copper foil substrates. The production process comprises the steps of etching the first substrate, etching the second substrate and the third substrate and spreading glue; and respectively covering the upper surface and the lower surface by using the drilled second substrate and the drilled third substrate and performing positioning and press-fitting. The production process for improving blind routing depth accuracy has the advantages that the equipment cost is saved, the process is simple, the operation is simple and convenient to perform, the depth accuracy is high and the production process is stable.

Description

Technical field [0001] The invention relates to a production process for improving the depth accuracy of blind fishing, in particular, it is used to improve the depth accuracy of a blind fishing area on a printed circuit board and meet the requirements of customers for high depth accuracy of the blind fishing area, and belongs to the field of electronic technology. Background technique [0002] With the development trend of lighter, thinner, integrated and multifunctional consumer electronic products, the requirements for the production process of printed circuit boards are getting higher and higher. Following this trend, printed circuit boards using blind fishing have gradually become an important part of various consumer electronic printed circuit boards. Blind fishing processing is simply to use a milling cutter to flatten the bottom surface of the blind groove or its surface roughness on the circuit board after the circuit board is formed. [0003] At present, ordinary forming...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 郑方荣
Owner GULTECH WUXI ELECTRONICS CO LTD
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