Epoxy resin curing agent and preparation method thereof

An epoxy resin curing and solvent technology, which is applied in the field of polymer materials, can solve the problems of poor weather resistance, moisture absorption and impact resistance, and poor ability to apply force, and achieve good curing performance, simple preparation process, and economical cost effect
CN103421140AActive Publication Date: 2013-12-04CHINA BLUESTAR CHENGRAND CO LTD

Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
CHINA BLUESTAR CHENGRAND CO LTD
Publication Date
2013-12-04
Patent Text Reader

Abstract

The invention relates to an epoxy resin curing agent and a preparation method thereof. The epoxy resin curing agent comprises the following raw materials in parts by weight: 30-60 parts of methacrylic acid dimethylamine ethyl ester, 20-30 parts of methyl methacrylate, 10-20 parts of isoamyl methacrylate, 10-20 parts of hydroxyethyl methacrylate, 0.5-3 parts of an initiating agent, and 50-100 parts of solvent. According to the invention, the methacrylic acid dimethylamine ethyl ester with unsaturated bond is adopted as a main comonomer, and tertiary amine which can be used for performing cross-linking and solidification reaction with the epoxy resin is directly inserted into a macromolecular chain, so that the epoxy resin can be solidified, the toughening modification effect is achieved, and a curing agent and a flexibilizer are not required at one time; therefore the cost is saved and the technology is simplified.
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Description

technical field

[0001] The invention relates to an epoxy resin curing agent and a preparation method thereof. Specifically, the invention relates to an epoxy resin curing agent with toughening performance and a preparation method thereof, belonging to the technical field of polymer materials. Background technique

[0002] Epoxy resin is a kind of thermosetting resin, which is widely used in adhesives, high-performance-light-weight fiber-reinforced composite materials, coatings and composite material substrates due to its excellent adhesion, mechanical strength and electrical insulation properties. In addition, epoxy resin adhesives are widely used in structural adhesives due to their good properties. However, its obvious brittleness and poor weather resistance, fatigue resistance, heat resistance, moisture absorption and impact resistance make it less able to withstand external forces under high stress, which is an unavoidable shortcoming. Therefore, it is necessary to toug...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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