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Epoxy resin curing agent and preparation method thereof

An epoxy resin curing and solvent technology, which is applied in the field of polymer materials, can solve the problems of poor weather resistance, moisture absorption and impact resistance, and poor ability to apply force, and achieve good curing performance, simple preparation process, and economical cost effect

Active Publication Date: 2013-12-04
CHINA BLUESTAR CHENGRAND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its obvious brittleness and poor weather resistance, fatigue resistance, heat resistance, moisture absorption and impact resistance make it less able to withstand external forces under high stress, which is an unavoidable shortcoming

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Product example:

[0044] An epoxy resin curing agent is characterized in that: comprising the following raw materials in parts by weight:

[0045] Dimethylaminoethyl methacrylate 30 parts

[0046] Methyl methacrylate 20 parts

[0047] 10 parts of isoamyl methacrylate

[0048] 10 parts of hydroxyethyl methacrylate

[0049] Initiator 0.5 parts

[0050] Solvent 50 parts.

Embodiment 2

[0052] Product example:

[0053] An epoxy resin curing agent is characterized in that: comprising the following raw materials in parts by weight:

[0054]Dimethylaminoethyl methacrylate 60 parts

[0055] 30 parts of methyl methacrylate

[0056] 20 parts of isoamyl methacrylate

[0057] 20 parts of hydroxyethyl methacrylate

[0058] Initiator 0.5-3 parts

[0059] 50-100 parts of solvent.

Embodiment 3

[0061] Product example:

[0062] An epoxy resin curing agent is characterized in that: comprising the following raw materials in parts by weight:

[0063] Dimethylaminoethyl methacrylate 45 parts

[0064] Methyl methacrylate 25 parts

[0065] 15 parts of isoamyl methacrylate

[0066] 15 parts of hydroxyethyl methacrylate

[0067] Initiator 1.75 parts

[0068] 75 parts of solvent.

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PUM

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Abstract

The invention relates to an epoxy resin curing agent and a preparation method thereof. The epoxy resin curing agent comprises the following raw materials in parts by weight: 30-60 parts of methacrylic acid dimethylamine ethyl ester, 20-30 parts of methyl methacrylate, 10-20 parts of isoamyl methacrylate, 10-20 parts of hydroxyethyl methacrylate, 0.5-3 parts of an initiating agent, and 50-100 parts of solvent. According to the invention, the methacrylic acid dimethylamine ethyl ester with unsaturated bond is adopted as a main comonomer, and tertiary amine which can be used for performing cross-linking and solidification reaction with the epoxy resin is directly inserted into a macromolecular chain, so that the epoxy resin can be solidified, the toughening modification effect is achieved, and a curing agent and a flexibilizer are not required at one time; therefore the cost is saved and the technology is simplified.

Description

technical field [0001] The invention relates to an epoxy resin curing agent and a preparation method thereof. Specifically, the invention relates to an epoxy resin curing agent with toughening performance and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] Epoxy resin is a kind of thermosetting resin, which is widely used in adhesives, high-performance-light-weight fiber-reinforced composite materials, coatings and composite material substrates due to its excellent adhesion, mechanical strength and electrical insulation properties. In addition, epoxy resin adhesives are widely used in structural adhesives due to their good properties. However, its obvious brittleness and poor weather resistance, fatigue resistance, heat resistance, moisture absorption and impact resistance make it less able to withstand external forces under high stress, which is an unavoidable shortcoming. Therefore, it is necessary to toug...

Claims

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Application Information

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IPC IPC(8): C08F220/34C08F220/14C08F220/18C08F220/28C08G59/50
Inventor 何琦
Owner CHINA BLUESTAR CHENGRAND CO LTD
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