Preparation method of double pore structure porous copper material for enhanced boiling heat transfer

A technology of enhanced boiling and double holes, which is applied in the field of metal porous materials, can solve the problems of low heat transfer efficiency, small number of vaporization cores, and small heat exchange surface area of ​​enhanced boiling, and is suitable for large-scale production, with a large number of vaporization cores, The effect of large heat exchange area

A technology of enhanced boiling and double holes, which is applied in the field of metal porous materials, can solve the problems of low heat transfer efficiency, small number of vaporization cores, and small heat exchange surface area of ​​enhanced boiling, and is suitable for large-scale production, with a large number of vaporization cores, The effect of large heat exchange area

CN103465543BActive Publication Date: 2015-07-29NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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  • Preparation method of double pore structure porous copper material for enhanced boiling heat transfer
  • Preparation method of double pore structure porous copper material for enhanced boiling heat transfer
  • Preparation method of double pore structure porous copper material for enhanced boiling heat transfer

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Effect test

Embodiment 1

[0026] The preparation method of the double-pore structure porous copper material for enhanced boiling heat transfer in this embodiment comprises the following steps:

[0027] Step 1. Put the copper plate and the copper fiber felt into an ultrasonic cleaning machine filled with acetone for ultrasonic cleaning, and then place them in an oven for drying; the thickness of the copper plate is 2 mm, and the copper fiber felt has a wire diameter of 60 μm copper fiber rough felt;

[0028] Step 2. Spread the dried copper fiber felt in step 1 on the surface of the dried copper plate, then put the copper plate covered with copper fiber felt into the sintering furnace for sintering, and after natural cooling, attach a layer on the surface of the copper plate A copper fiber porous layer with a thickness of 2mm and a porosity of 90%; the sintering temperature is 900°C, and the sintering time is 1h;

[0029] Step 3, the KOH solution with a concentration of 1mol / L is the anode oxidation ele...

Embodiment 2

[0032] The preparation method of the double-pore structure porous copper material for enhanced boiling heat transfer in this embodiment comprises the following steps:

[0033] Step 1. Put the copper plate and the copper fiber felt into an ultrasonic cleaning machine filled with absolute ethanol for ultrasonic cleaning, and then place them in an oven for drying; the thickness of the copper plate is 2 mm, and the copper fiber felt is 2 mm in diameter. 160μm copper fiber sintered mat;

[0034] Step 2. Spread the dried copper fiber felt in step 1 on the surface of the dried copper plate, then put the copper plate covered with copper fiber felt into the sintering furnace for sintering, and after natural cooling, attach a layer on the surface of the copper plate A copper fiber porous layer with a thickness of 0.5mm and a porosity of 95%; the sintering temperature is 1000°C, and the sintering time is 2h;

[0035] Step 3: The KOH solution with a concentration of 0.5mol / L is used as t...

Embodiment 3

[0038] The preparation method of the double-pore structure porous copper material for enhanced boiling heat transfer in this embodiment comprises the following steps:

[0039] Step 1. Put the copper plate and the copper fiber felt into an ultrasonic cleaning machine filled with absolute ethanol for ultrasonic cleaning, and then place them in an oven for drying; the thickness of the copper plate is 2 mm, and the copper fiber felt is 2 mm in diameter. 30μm copper fiber rough felt;

[0040] Step 2. Spread the dried copper fiber felt in step 1 on the surface of the dried copper plate, then put the copper plate covered with copper fiber felt into the sintering furnace for sintering, and after natural cooling, attach a layer on the surface of the copper plate A copper fiber porous layer with a thickness of 3mm and a porosity of 80%; the sintering temperature is 850°C, and the sintering time is 2h;

[0041] Step 3, the KOH solution with a concentration of 2mol / L is the anode oxidation...

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Abstract

The invention provides a method for preparing dual-hole-structure multi-hole copper materials strengthening a boiling heat transfer function. The method comprises the following steps that (1) ultrasonic cleaning and drying are respectively carried out on a copper matrix and a copper fiber mat; (2) the copper fiber mat is laid on and covers the surface of the copper matrix, then sintering is carried out, and a copper fiber multi-hole layer is attached to the surface of the copper matrix; (3) anodic oxidation treatment is carried out on the copper matrix with the copper fiber multi-hole layer in an attached mode to obtain the dual-hole-structure multi-hole copper materials strengthening the boiling heat transfer function. The method is simple, reasonable in design, easy to implement, strong in operability and suitable for large-scale production. The multi-hole copper materials prepared through the method are of a dual-hole structure, the specific surface area is large, a large amount of nucleate boiling is achieved, the heat transfer effect is good, and important practical value and important popularization significance are achieved.

Description

technical field [0001] The invention belongs to the technical field of metal porous materials, and in particular relates to a preparation method of a double-pore structure porous copper material for enhanced boiling heat transfer. Background technique [0002] With the advancement of science and technology, people put forward higher and higher performance requirements for boiling heat transfer. At present, scholars from various countries have carried out extensive theoretical analysis, experimental research and technical exploration on boiling heat transfer, and proposed a variety of theories and methods to enhance boiling heat transfer. Among them, the most effective method of enhancing boiling heat transfer is to use various types of enhanced boiling. heat transfer material. Existing enhanced boiling heat transfer materials usually have various shapes of grooves, fins or porous surfaces. Among them, enhanced boiling heat transfer materials with porous surfaces are known f...

Claims

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Application Information

Patent Timeline
29 Jul 2015
Publication
CN103465543B
IPC
B32B15/01; B32B15/14; B32B15/20; C25D11/34
Inventors
支浩; 汤慧萍