Modularized high-frequency link power conversion system of plug-and-play structure

A plug-and-play, conversion system technology, applied to output power conversion devices, conversion equipment with intermediate conversion to AC, electrical components, etc., can solve problems such as difficult expansion, difficult management, bulky volume, etc., to achieve convenient production , Improve the degree of modularization and increase the effect of power density

Inactive Publication Date: 2014-01-15
TSINGHUA UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This structure is usually bulky, difficult to manage, difficult to expand, assemble and maintain, which seriously

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  • Modularized high-frequency link power conversion system of plug-and-play structure
  • Modularized high-frequency link power conversion system of plug-and-play structure

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Embodiment Construction

[0016] Specific embodiments of the present invention will be described in detail below in conjunction with the technical solutions of the present invention and the accompanying drawings.

[0017] The high-frequency chain power conversion system of the modularized plug-and-play structure realized in the embodiment of the present invention is as follows: figure 1 shown. The system includes: a power supply module M1 with a plug-and-play interface, a control module M2 with a plug-and-play interface, a signal processing module M3 with a plug-and-play interface, two Power modules PM1 and PM2 with plug-and-play interfaces, a high-frequency isolation transformer T, and a motherboard MB with plug-and-play interfaces; the power module, control module, signal processing module and power module They are inserted into the corresponding plug-and-play interfaces XB1, XB2, XB3, PXB1, PXB2 of the motherboard through their respective plug-and-play interfaces X1, X2, X3, PX1, PX2, and are conne...

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Abstract

The invention discloses a modularized high-frequency link power conversion system of a plug-and-play structure, and belongs to the technical field of power electronics. The system comprises a power supply module with a plug-and-play port, a control module with a plug-and-play port, a signal processing module with a plug-and-play port, one or more power modules with plug-and-play ports, one or more high-frequency isolation transformers and a mother board with multiple plug-and-play ports. The power supply module, the control module, the signal processing module and the power modules are inserted into the corresponding plug-and-play ports respectively of the mother board through respective play-and-plug ports, and signal transmission is achieved through a signal connection bus on the mother board. The power modules are connected through power connection buses, and the power modules and the high-frequency isolation transformers are connected through power connection buses. The plug-and-play function of the power conversion system can be achieved, and production, assembling and maintenance are facilitated through a modularized structure.

Description

technical field [0001] The invention belongs to the technical field of power electronics, and relates to a high-frequency link power conversion system, in particular to a high-frequency link power conversion system with a modular plug-and-play structure. Background technique [0002] Existing power conversion systems usually implement voltage matching and electrical isolation through power frequency transformers. However, due to the large volume, heavy weight, large loss and high noise of the power frequency transformer, it is difficult to achieve high power density and high efficiency of the power conversion system. As power conversion systems become more and more popular in smart grids, this has become a major obstacle to realize high power density and high efficiency power converters. [0003] In recent years, the replacement of traditional power frequency transformers by using high frequency transformers is generally considered to be the inevitable development trend of ...

Claims

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Application Information

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IPC IPC(8): H02M1/00H02M3/28
Inventor 赵彪宋强刘文华
Owner TSINGHUA UNIV
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