SRIO interconnection exchanging device based on field programmable gate array (FPGA)

A technology of switching devices and interconnecting modules, applied in the field of communications, can solve the problems of low cost performance, occupation, and high chip prices.

Active Publication Date: 2014-01-22
WUHAN POST & TELECOMM RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In an embedded device, there may be multiple different types of chips (such as CPU, DSP, FPGA, etc.) or multiple boards that require high-speed communication. These chips or boards support the SRIO protocol to transmit data, so for inter-chip The communication between the boards requires an SRIO interconnection switching device. The existing technology often uses a dedicated SRIO switching chip. Generally, this chip is expensive, has poor flexibility, and occupies a lot of board area, especially for interconnection chips or Low cost performance when the number of boards is small

Method used

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  • SRIO interconnection exchanging device based on field programmable gate array (FPGA)
  • SRIO interconnection exchanging device based on field programmable gate array (FPGA)

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Embodiment Construction

[0023] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be introduced below in conjunction with the embodiments of the present invention and the accompanying drawings.

[0024] See attached figure 1 , The SRIO interconnection exchange device provided by the embodiment includes an SRIO interconnection module, a FIFO module, and an SRIO interface module:

[0025] SRIO interconnect module, used to exchange data between various chips or boards within the FPGA to achieve data exchange between chips or boards;

[0026] The FIFO module is used to isolate the SRIO interconnection module from the SRIO interface module, and also serves as a data buffer;

[0027] The SRIO interface module is used to ensure that the FPGA receives or sends data based on the SRIO protocol.

[0028] The present invention implements the SRIO interconnection exchange device based on the programm...

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Abstract

Disclosed is an SRIO interconnection exchanging device based on an FPGA. An SRIO interconnection module, FIFO modules and an SRIO interface module are arranged in the FPGA. Data of all source apparatuses enter the SRIO interconnection module through the SRIO interface module and then enter the FIFO module after being scheduled by the SRIO interconnection module, and the FIFO module transmits the data to the SRIO interface module which outputs the data to target apparatuses. Given that the SRIO interface module supplies n interfaces, each interface supports one apparatus, the SRIO interconnection module supplies an arbiter for each apparatus, and an FIFO module is set corresponding to each apparatus. When the apparatus connected with certain interface is a target apparatus, the corresponding arbiter of the target apparatus performs time division slicing scheduling on data input from the interfaces of all source apparatuses according to data packets, and the scheduled data packets are output from corresponding SRIO interfaces through the corresponding FIFO modules.

Description

technical field [0001] The invention belongs to the technical field of communication, and in particular relates to an FPGA-based SRIO interconnection switching device. Background technique [0002] Rapid IO technology is a high-speed interconnection bus, which is often used in the internal interconnection of systems in the high-performance embedded device market, supporting chip-to-chip and board-to-board communication, while Serial Rapid IO (SRIO) can use fewer connections Lines can achieve performance levels from 1Gbps to 60Gbps, so they are widely used. [0003] FPGA is a programmable logic device with programmable flexibility that other ASIC (integrated circuit) chips do not have. At the same time, FPGA has abundant I / O pins, short development cycle and high reliability. [0004] In an embedded device, there may be multiple different types of chips (such as CPU, DSP, FPGA, etc.) or multiple boards that require high-speed communication. These chips or boards support the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F13/26
Inventor 秦刚郑璐王兴张磊
Owner WUHAN POST & TELECOMM RES INST CO LTD
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