Multilayered circuit board structure with buried element and manufacturing method

Abstract

The invention discloses a multilayered circuit board structure with a buried element and a manufacturing method. The manufacturing method comprises the following steps of providing a substrate with a first surface and first contraposition marks; arranging semiconductor elements on the substrate; forming a dielectric layer, which covers the semiconductor element, is provided with a second surface and has second contraposition marks, on the substrate; enabling the second contraposition marks to correspond to the semiconductor elements; forming a first through hole group which comprises a plurality of through holes extending to the first surface from the second surface and a second through hole group which comprises a plurality of second through holes extending to the semiconductor elements from the second surface by using the first contraposition marks and the second contraposition marks as contraposition references; forming a wire group on the second surface; and patterning the wire group in two stages so as to respectively obtain a first wire group and a second wire group which are connected with each other.

Description

technical field [0001] The invention relates to a circuit board structure and a manufacturing method, in particular to a multilayer circuit board structure with embedded components and a manufacturing method thereof. Background technique [0002] In the semiconductor industry, the purpose of chip assembly is to protect the bare chip from moisture, heat and noise, and to provide a medium for electrical connection between the bare chip and external circuits. In recent years, with the rapid development of electronic technology and the continuous integration and innovation of high-tech electronic products, traditional semiconductor packaging technology has been unable to meet product function and cost requirements. At present, semiconductor construction technology has moved towards the trend of integrating chips into circuit substrates, so that the entire construction area and volume can be greatly reduced to meet the needs of light, thin, short, high-function, high-speed and hi...

AI Technical Summary

Problems solved by technology

Such a manufacturing process is not only complicated in steps, but also, laser drilling from the surface of the circuit board is likely to cause laser offset or alignment errors

In particular, when there are many embedded components or circuit layers in the circuit board, the alignment effect of the conductive vias is less ideal, thus reducing the production yield of the circuit board

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