Resin cementing material for repairing normal temperature cold mixing steel bridge floor swag

A technology of resin glue and steel bridge deck, which is applied in the field of resin cementitious materials, can solve the problems of threatening the safety of bridges, the failure of the bonding layer, and the crushing of the pavement layer, so as to improve the overall toughness, prevent secondary cracking, and increase flexibility. Effect

Active Publication Date: 2014-02-05
JSTI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the typical epoxy asphalt paved bridges in China, such as Nanjing Second Bridge, Runyang Bridge, Yangluo Bridge, etc., have cracks, potholes and other diseases due to the increasing traffic volume and axle load. Cause rainwater infiltration, failure of bonding layer, crushing of pavement layer, corrosion of steel plate and other serious damages, threatening bridge safety
[0004] Currently widely used epoxy asphalt materials are prone to secondary cracking at construction joints, forming stress concentration and causing deep-seated diseases
At present, there is no epoxy resin material specially used for quick repair of steel bridge deck pavement maintenance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] 1. Preparation of mixture A and mixture B

[0016] a, preparation of mixture A

[0017] Prepare in the following parts by weight: 50 parts of bisphenol A epoxy resin, 7 parts of epoxy-terminated liquid nitrile rubber ETBN, 80 parts of epoxy-terminated block polyether ETPEG and 2 parts of butyl glycidyl ether BGE, in Mix the above components at room temperature to form a mixture A.

[0018] b. Preparation of mixture B

[0019] Prepared according to the following parts by weight: 25 parts of 651 low-molecular polyamide, 3 parts of γ-aminopropyltriethoxysilane KH-550, 2,4,6-tris(dimethylaminomethyl)phenol DMP-30 5 parts, the above-mentioned components were mixed at room temperature to form mixture B.

[0020] 2. Preparation of cement

[0021] The above-prepared mixture A and mixture B were prepared by weight according to a weight ratio of 3:1, and then stirred and mixed to obtain the resin binder of this embodiment.

Embodiment 2

[0023] 1. Preparation of mixture A and mixture B

[0024] a, preparation of mixture A

[0025] Prepare according to the following parts by weight: 100 parts of bisphenol A epoxy resin, 10 parts of epoxy-terminated liquid nitrile rubber ETBN, 100 parts of epoxy-terminated block polyether ETPEG and 3 parts of butyl glycidyl ether BGE. The above components are mixed to form Mixture A.

[0026] b. Preparation of mixture B

[0027] Prepared according to the following parts by weight: 75 parts of 651 low-molecular polyamide, 5 parts of γ-aminopropyltriethoxysilane KH-550, 2,4,6-tris(dimethylaminomethyl)phenol DMP-30 8 parts, the above-mentioned components were mixed at room temperature to form mixture B.

[0028] 2. Preparation of cement

[0029] The above-prepared mixture A and mixture B were prepared by weight according to a weight ratio of 3:1, and then stirred and mixed to obtain the cementitious material of this embodiment.

Embodiment 3

[0031] 1. Preparation of mixture A and mixture B

[0032] a, preparation of mixture A

[0033] Prepared in the following parts by weight: 25 parts of bisphenol A epoxy resin, 4 parts of epoxy-terminated liquid nitrile rubber ETBN, 100 parts of epoxy-terminated block polyether ETPEG and 1 part of butyl glycidyl ether BGE, in Mix the above components at room temperature to form a mixture A.

[0034] b. Preparation of mixture B

[0035] Prepared according to the following parts by weight: 13 parts of 651 low-molecular polyamide, 3 parts of γ-aminopropyltriethoxysilane KH-550, 2,4,6-tris(dimethylaminomethyl)phenol DMP-30 2 parts, the above-mentioned components were mixed at room temperature to form mixture B.

[0036] 2. Preparation of cement

[0037] The above-prepared mixture A and mixture B were prepared by weight according to a weight ratio of 3:1, and then stirred and mixed to obtain the cementitious material of this embodiment.

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Abstract

The invention discloses a resin cementing material for repairing a normal temperature cold mixing steel bridge floor swag. The resin cementing material consists of a mixture A and a mixture B, wherein the mixture A consists of the following components in parts by weight: 15-100 parts of bisphenol A epoxy resin, 80-100 parts of terminal epoxy block polyether, 2-25 parts of terminal epoxy liquid acrylonitrile butadiene rubber and 2-12 parts of butyl glycidyl ether; the mixture B consists of the following components in parts by weight: 10-75 parts of 651 low molecular polyamide, 2-5 parts of gamma-aminopropyltriethoxysilane and 2-10 parts of 2,4,6-tri(dimethylaminomethyl) phenol; the weight ratio of the mixture A to the mixture B is 3:1. The resin cementing material disclosed by the invention can fully meet requirements for pavement maintenance engineering of an epoxy asphalt bridge floor, and can effectively prevent secondary cracking of construction joints.

Description

technical field [0001] The invention belongs to the field of civil engineering materials, and in particular relates to a normal-temperature cold-mixed resin binder used for repairing pits and ponds on steel bridge decks. Background technique [0002] Since the Second Nanjing Bridge, more and more epoxy asphalt materials have been used as the cementing material for bridge deck pavement in newly-built steel box girder bridges and steel truss bridges in my country, which has greatly improved the performance and service life of bridge deck pavement. [0003] At present, the typical epoxy asphalt paved bridges in China, such as Nanjing Second Bridge, Runyang Bridge, Yangluo Bridge, etc., have cracks, potholes and other diseases due to the increasing traffic volume and axle load. It will cause rainwater infiltration, failure of bonding layer, crushing of pavement layer, corrosion of steel plate and other serious damages, threatening the safety of the bridge. [0004] Curr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L71/00C08L15/00C08G59/60
Inventor 潘友强李晖于迪尔张辉张健朱雷
Owner JSTI GRP CO LTD
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