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Deplating solution for removing nickel on cooper surface, preparation method thereof, and method for removing nickel on cooper surface

A technology for stripping solution and copper surface, applied in stripping solution and its preparation, in the field of removing nickel on copper surface, which can solve problems such as harm to human body and affecting copper layer.

Active Publication Date: 2014-02-12
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention solves the technical problem that the deplating agent used in the chemical deplating method in the prior art produces volatile irritating gases that are harmful to the human body and simultaneously affects the quality and bonding force of the copper layer and the subsequent plating layer

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0021] As a preferred embodiment of the present invention, the content of each component in the stripping solution is:

[0022] Sulfuric acid 120-180g / L;

[0023] Hydrogen peroxide 80-150g / L;

[0024] Ethylenediamine 120-240g / L;

[0025] Cysteine ​​10-30g / L;

[0026] Sulfamic acid 3-7g / L.

[0027] The invention also provides a preparation method of the stripping solution, which comprises dissolving sulfuric acid, hydrogen peroxide, ethylenediamine, cysteine ​​and sulfamic acid in water in proportion to form an aqueous solution.

[0028] Preferably, the sulfuric acid aqueous solution is prepared first, and then hydrogen peroxide, ethylenediamine and cysteine ​​are sequentially added to the sulfuric acid aqueous solution to obtain a mixed system; the sulfamic acid is dissolved in water to form a sulfamic acid solution, and then the sulfamic acid solution is mixed with the mixed system to obtain the deplating solution.

[0029] Finally, the present invention provides a metho...

Embodiment 1

[0035] According to the following formula, first prepare sulfuric acid into an aqueous solution and sulfamic acid into an aqueous solution; then add hydrogen peroxide, ethylenediamine and cysteine ​​to the sulfuric acid aqueous solution in sequence to obtain a mixed system; then mix the sulfamic acid aqueous solution with the mixed system Uniformly, obtain stripping solution S1, each component content is in this stripping solution S1: sulfuric acid 150g / L, hydrogen peroxide 100g / L, ethylenediamine 180g / L, cysteine ​​7g / L, sulfamic acid 5g / L L.

Embodiment 2

[0037] According to the following formula, first prepare sulfuric acid into an aqueous solution and sulfamic acid into an aqueous solution; then add hydrogen peroxide, ethylenediamine and cysteine ​​to the sulfuric acid aqueous solution in sequence to obtain a mixed system; then mix the sulfamic acid aqueous solution with the mixed system Uniformly, obtain stripping solution S2, each component content is in this stripping solution S2: sulfuric acid 120g / L, hydrogen peroxide 90g / L, ethylenediamine 135g / L, cysteine ​​5g / L, sulfamic acid 3g / L L.

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Abstract

The invention provides a deplating solution for removing nickel on cooper surface. The deplating solution contains water solutions of following components: 100 to 200 g / L of sulfuric acid, 50 to 200 g / L of hydrogen peroxide, 90 to 270 g / L of ethene diamine, 5 to 50 g / L of cysteine, and 1 to 10 g / L of sulfamic acid. The invention also provides a preparation method of the deplating solution, and a method for removing nickel on cooper surface by using the deplating solution. The deplating solution provided by the invention is capable of carrying out a process on a tool to be deplated at a room temperature, barely no volatile irritant gas is generated during the deplating process, so the deplating solution is very environment-friendly; and at the same time, the quality and thickness of the copper layer, and the combining force between the copper layer and subsequent coating are not affected.

Description

technical field [0001] The invention belongs to the technical field of chemical stripping, and in particular relates to a stripping solution for stripping nickel on a copper surface, a preparation method thereof and a method for stripping nickel on a copper surface. Background technique [0002] In the modern electroplating process, it is often necessary to plate a metal nickel layer on the metal copper to prevent corrosion and rust, or to plate other metal transition coatings on the metal copper. Since the nickel layer is prone to quality problems during the nickel plating process on the copper surface, it is necessary to strip the nickel layer and then re-plate the nickel layer. Regarding the plating stripping process, chemical or electrochemical stripping methods can generally be used. Electrochemical stripping solution has simple composition, weak corrosion to the substrate, and can be recycled for some metals, which is beneficial to environmental protection, but it nee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23G1/10
Inventor 韦家亮连俊兰林宏业
Owner BYD CO LTD
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