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An Optical Proximity Correction Method

A technology of optical proximity and photolithography, applied in optics, optomechanical equipment, originals for optomechanical processing, etc., can solve the problems of product quality, impact on circuit performance, time-consuming and easy to miss

Active Publication Date: 2016-05-11
CSMC TECH FAB2 CO LTD
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Problems solved by technology

This shrinkage can lead to defects in the actual produced metal wire, such as figure 2 As shown, in the example cited above, the widest point of the defect 13 can reach 0.008 μm, which has a serious impact on the performance of the circuit
[0006] At present, there is no correction plan for this problem in the OPC program, and it needs to rely on manual inspection by personnel, which is time-consuming and easy to miss, resulting in product quality problems

Method used

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Embodiment Construction

[0029] As mentioned in the background art, because in the An (metal wiring level), in order to cover holes used as conductive plugs, some metal lines may have bumps. In the existing OPC optimization processing program, there is no step of judging whether these protrusions are useful structures, so after the OPC optimization is completed, defects are often formed in these protrusions, and these defects not only destroy the metal The structural characteristics of the line itself, and on the contrary, further expose the place that originally needs to cover the hole, which seriously affects the quality of the device. Therefore, it is necessary to optimize the existing optical proximity correction method to avoid these defects and improve the quality of semiconductor devices.

[0030] The present invention aims at the above problems. In the existing OPC program, a cleaning program for the protrusions caused by covering holes is added. Before the OPC processing program is executed, ...

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Abstract

An optical proximity correction (OPC) method, the method comprising: adding to an optical proximity correction procedure a cleaning program for repairing the protrusions caused by the covering of holes; before executing an OPC processing program, running the cleaning program for a target graphic to repair all the protrusions caused by the holes, thus preventing defects from being generated due to the protrusions during OPC processing. The execution of the cleaning program of the present invention relies wholly on graphic software without adjusting the hardware of an existing OPC device, and is automatic and fast, thus having little impact on the period of the process, and greatly saving cost while improving product quality.

Description

technical field [0001] The invention relates to a photolithography process in the semiconductor manufacturing industry, in particular to an optical proximity correction (Optical Proximity Correction, OPC) method in the process of preparing a mask. Background technique [0002] Photolithography is the driving force behind the development of integrated circuit manufacturing processes, and it is also one of the most complex technologies. Compared with other individual manufacturing technologies, photolithography has made a revolutionary contribution to the improvement of chip performance. Before the lithography process begins, the structure of the integrated circuit will be copied to a larger (relative to the silicon wafer for production) quartz glass sheet called a mask by a specific device, and then a specific wavelength will be generated by the lithography device Ultraviolet light (such as ultraviolet light with a wavelength of 248nm) copies the structure of the integrated ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F1/36
CPCG03F7/70441G03F1/36
Inventor 陈洁王谨恒万金垠张雷
Owner CSMC TECH FAB2 CO LTD
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