Substrate loading system and method for substrate loading dedicated to substrate machine
A substrate and vision system technology, applied in conveyor objects, opto-mechanical equipment, instruments, etc., can solve the problems of increasing equipment and production costs, and complicating the control process of lithography equipment, achieving compact structure, diverse functions, and reducing production. cost effect
Active Publication Date: 2016-06-01
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology
[0006] The present invention is aimed at the defects in the prior art that the traditional lithography equipment uses manipulators as the transfer medium for loading and unloading films, which not only increases the equipment and production costs, but also complicates the control process of the lithography equipment, and provides a substrate machine dedicated to the substrate. chip system
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[0033] In order to illustrate the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.
[0034] see figure 1 , figure 2 , figure 1 Shown is a schematic diagram of the three-dimensional structure of the substrate loading system dedicated to the substrate machine of the present invention. figure 2 Shown is a schematic diagram of the three-dimensional structure of the pre-alignment module of the substrate loading system dedicated to the substrate machine of the present invention. The substrate loading system 1 dedicated to the substrate machine includes a linear hand 10, the linear hand 10 has a first station 101 and a second station 102 arranged at intervals, and is movable on the horizontal plane of the linear hand 10 A plate fork 103 that can reciprocate between the first station 101 and the second station 102; a pre-al...
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The invention discloses a substrate slice loading system special for a substrate machine table. The system comprises a straight line hand, a prealignment lifting table, an edge detection visual system and a rotating connecting hand. The straight line hand is provided with a first station and a second station which are arranged at an interval, a plate fork which conducts reciprocating motion between the first station and the second station is movably arranged on the horizontal face of the straight line hand, the prealignment lifting table is used for lifting a substrate to be loaded with slices to the first preset height or the second preset height, the edge detection visual system is used for conducting sampling and scanning on the substrate to be loaded with the slices at the first preset height, and the rotating connecting hand is used for conducting connection on the prealignment lifting table at the second preset height so as to complete the slice loading process of the substrate to be loaded with the slices. The substrate slice loading system special for the substrate machine table is compact in structure, diversified in function, and capable of being compatible with different-specification substrates to be loaded with the slices, meanwhile, improves the integration level and reduces the production cost of the device.
Description
technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a substrate loading system dedicated to a substrate machine and a wafer loading method thereof. Background technique [0002] In the 15th "863" plan, the country included integrated circuit manufacturing equipment in major special plans, with the development of 0.1μm lithography machine as the main strategic goal, to achieve local breakthroughs in my country's integrated circuit manufacturing equipment and IC equipment industry leapfrog development. On the surface, the silicon wafer processing system is not the core system of IC manufacturing equipment, but when the semiconductor process develops from the micron level to the deep sub-micron level, the IC manufacturing equipment has very strict requirements for each subsystem. The results of the processing system directly affect the accuracy and production efficiency of the whole machine. Although the silicon wafe...
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IPC IPC(8): H01L21/677G03F7/20
CPCG03F7/70733H01L21/67766
Inventor 徐烨王邵玉
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD