A semiconductor structure, a doping method thereof, and a method for forming a fin field effect transistor
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SEMICON MFG INT (SHANGHAI) CORP
- Publication Date
- 2014-02-19
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor structure and its doping method, and a method for forming a fin field effect transistor. Background technique
[0002] MOS transistors generate switching signals by applying a voltage to the gate to adjust the current through the source and drain regions. However, when the semiconductor technology enters the node below 30 nanometers, the traditional planar MOS transistor has a weak ability to control the channel current, resulting in serious leakage current. Fin Field Effect Transistor (Fin FET) is an emerging multi-gate device, which generally includes a semiconductor fin with a high aspect ratio, in which the channel region and source / drain region of the transistor are formed, and in part of the fin The gate is formed on the top and outside the sidewalls of the portion.
[0003] figure 1 A schematic diagram of a three-dimensional structure of a fin ...