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Composite heat dissipation layer of power component, technology of composite heat dissipation layer of power component and power component with composite heat dissipation layer

A technology of composite heat dissipation layer and power components, which is applied in semiconductor/solid-state device parts, electrical components, electric solid-state devices, etc., can solve the problems of high manufacturing cost, increase the volume of power components, and complex installation process, and reduce the temperature rise. , Improve the service life, the effect of uniform weight

Active Publication Date: 2014-02-19
GUANGDONG MENLO ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the heat dissipation material is liquid metal with fluidity, the liquid metal must be packaged outside the power component with a casing, which increases the volume of the power component, and the installation process is complicated and the manufacturing cost is high.

Method used

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  • Composite heat dissipation layer of power component, technology of composite heat dissipation layer of power component and power component with composite heat dissipation layer
  • Composite heat dissipation layer of power component, technology of composite heat dissipation layer of power component and power component with composite heat dissipation layer
  • Composite heat dissipation layer of power component, technology of composite heat dissipation layer of power component and power component with composite heat dissipation layer

Examples

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Embodiment 1

[0031] Embodiment one, see figure 1 and figure 2 As shown, a composite heat dissipation layer for power components, the composite heat dissipation layer 2 is composed of a layer of insulating thin layer 21 and a layer of solid metal heat dissipation thin layer 22, the bottom layer of the heat dissipation composite thin layer 2 is an insulating thin layer 21, The insulating thin layer 21 on the bottom layer is used to be in close contact with the outer surface of the power component.

[0032] The insulating thin layer 21 is polyester film, polypropylene film, etc., and its thickness is between 0.001mm and 0.200mm.

[0033] The solid metal heat dissipation thin layer 22 is a metal aluminum thin layer, a metal silver thin layer, a metal zinc thin layer, a zinc aluminum alloy thin layer, etc., and its thickness is between 0.10 mm and 0.30 mm.

[0034] A power component with a composite heat dissipation layer, including a power component main body 1 and a composite heat dissipat...

Embodiment 2

[0038] Embodiment two, the difference with embodiment one is: see image 3 and Figure 4 As shown, the heat dissipation composite layer 2 includes more than two layers of insulating thin layers 21 and more than two layers of solid metal heat dissipation thin layers 22, and the insulating thin layers 21 and solid metal heat dissipation thin layers 22 are stacked alternately.

Embodiment 3

[0039] The third embodiment differs from the power component with a composite heat dissipation layer in the first embodiment in that it includes a power component body with surface insulation, and at least one solid metal heat dissipation thin layer is provided on the outer surface of the power component body. Since the surface of the power component body itself is insulated, the insulating thin layer at the bottom of the composite heat dissipation layer can be omitted.

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Abstract

The invention relates to a composite heat dissipation layer of a power component, a technology of the composite heat dissipation layer of the power component and the power component with the composite heat dissipation layer. The composite heat dissipation layer is formed by compositing at least one thin insulating layer and at least one thin solid metal heat dissipation layer. The bottom layer of the thin composite heat dissipation layer is the thin insulating layer, and the insulating layer located at the bottom layer is used for being closely attached to the outer surface of the power component. After the composite heat dissipation layer is combined with the power component, the thin composite heat dissipation layer formed by compositing at least one thin insulating layer and at least one thin solid metal heat dissipation layer can be formed quickly on the surface of the power component; the thin composite heat dissipation layer can form a cambered heat dissipation layer on the surface of the power component, wherein the heat dissipation layer is of an arbitrary shape and is attached to the component. In this way, the weight of a product is uniform; traditional single sided heat conduction is transformed to multiple sided composite heat conduction by utilizing high heat conductivity of metal ( traditionally, single sided heat conduction is mainly adopted, and the heat conduction is not uniform in different directions); therefore, the heat produced by the power component can be conducted quickly and effectively, the temperature rise of the protected power component is reduced, and the service life of the power component is prolonged.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to an improved heat dissipation structure of the power component, thereby effectively reducing the volume of the heat sink attached to the power component, improving the heat dissipation efficiency of the power component, and effectively protecting the power component from overheating damage. Composite heat dissipation layer for power components and its technology, and power components with composite heat dissipation layer. Background technique [0002] Today's power components are designed using technologies such as SOC (system on chip) \ SIP (system package) \ 3D_Pack (three-dimensional stacked package) \ Module (component), and the device density is getting higher and higher, and the demand for heat dissipation is increasing; the current The package of power components mainly adopts single-sided heat dissipation mode to transfer heat to the radiator, and use the rad...

Claims

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Application Information

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IPC IPC(8): H01L23/373H01L23/552H01L21/56
Inventor 孔星
Owner GUANGDONG MENLO ELECTRIC POWER
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