Forward-installed LED chip without bonding wire and packaging method of forward-installed LED chip

Abstract

The invention discloses a forward-installed LED chip without a bonding wire. The forward-installed LED chip without the bonding wire is characterized by comprising an epitaxial chip, an N-type electrode, a P-type electrode, a fluorescent powder layer, isolation layers and solder layers; the epitaxial chip comprises a substrate, a buffer layer, an N-type layer, a luminescent layer, an electronic blocking layer, a P-type layer and an ITO layer, and net-shaped fingers are formed on the ITO layer; the N-type electrode, the P-type electrode and the fluorescent powder layer are formed on the epitaxial chip; the isolation layers are formed on the upper side of the epitaxial chip and the periphery of the epitaxial chip respectively; the solder layers are located between the N-type electrode and a corresponding external circuit and between the P-type electrode and a corresponding external circuit respectively. Meanwhile, the invention also discloses a manufacturing method of the forward-installed LED chip. By means of the forward-installed LED chip, the light extraction rate can be increased, light source quality is improved, a gold wire is not needed, manufacturing cost is reduced, and the reliability of an LED is improved; meanwhile, the electrodes are connected with the external circuits in a spot welding mode, and therefore the yield of the LED is increased.

Description

technical field [0001] The invention relates to LED production technology, in particular to a wire-free front-mounted LED chip and a packaging method thereof. Background technique [0002] Lighting is very important for human activities in dark places and at night. People in ancient times used primitive methods to obtain light sources, such as burning materials, burning oil or wax, and even using fireflies that can glow at night as light sources at night. However, with the advancement of technology, from the past incandescent bulbs and fluorescent lamps to the current light emitting diode (light emitting diode, LED), humans began to try other different methods to obtain light sources. As a new generation of environmentally friendly solid-state light sources, GaN-based LEDs have become the focus of attention. Compared with traditional light sources, LEDs have the advantages of long life, high reliability, small size, low power consumption, fast response, easy modulation and i...

AI Technical Summary

Problems solved by technology

However, the flip-chip structure also faces unavoidable technical difficulties. For example, the equipment required for the flip-chip structure is more expensive than that of the chip structure, and the accuracy of the flip-chip structure is higher.

Compared with the traditional formal structure, the vertical structure has greatly improved the heat dissipation effect and current crowding, but the vertical structure needs to peel off the sapphire, and the stripping process is complicated

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