Unlock instant, AI-driven research and patent intelligence for your innovation.

Bonding method of honeycomb sandwich structure of micro-perforated panel

A technology of honeycomb interlayer and micro-perforated plate, applied in chemical instruments and methods, lamination, lamination devices, etc., can solve the problems of micro-hole blockage on perforated plates, and achieve the effect of noise reduction

Inactive Publication Date: 2014-02-26
XIAN AIRCRAFT DESIGN INST OF AVIATION IND OF CHINA
View PDF6 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is: the present invention aims to solve the problem of micropore blockage on the perforated plate during the honeycomb bonding process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bonding method of honeycomb sandwich structure of micro-perforated panel
  • Bonding method of honeycomb sandwich structure of micro-perforated panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0015] A bonding method for a micro-perforated board honeycomb sandwich structure, characterized in that it comprises the following steps:

[0016] First, carry out surface treatment on the glued surface of the perforated panel before bonding, such as phosphoric acid anodization or chromic acid anodization;

[0017] Second, brush the primer on the bonding surface (front of the panel), and use airflow to blow off the primer in the micropores from the back of the panel, and then cure the above primer, which is used to improve the corrosion resistance of the bonded parts sex;

[0018] Thirdly, spread a medium-temperature curing adhesive film or a high-temperature curing adhesive film that matches the panel and honeycomb core on the above-mentioned bonding surface, and put it in an oven to heat the adhesive film to a molten state;

[0019] Fourth, take out the panel, an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a bonding method of a honeycomb sandwich structure of a micro-perforated panel. The method is characterized by comprising following steps of: subjecting a bonding surface of the micro-perforated panel before bonding to surface treatment, such as anodizing with phosphoric acid or anodizing with chromic acid; coating the bonding surface (the right surface of the panel) with a primer, blowing out the primer in the micropores by using air flow from the back side of the panel, and subjecting the primer used for improving corrosion resistance of bonding parts to curing treatment; paving medium-temperature curing adhesive film or high-temperature curing adhesive film which are matched with the panel and a honeycomb core on the bonding surface and putting into an oven and heating the adhesive film to a fusion state; taking out the panel, blowing out the adhesive film in the micropores by using air flow from the back side of the panel so as to avoid that a large number of the micropores on the panel are blocked by the adhesive film after curing processes; and pasting the honeycomb core on the panel with the adhesive film, putting into an autoclave and curing. The bonding method can solve a micropore blocking problem of the micro-perforated panel during a honeycomb bonding process, and can prepare a micro-perforated panel soundproofing liner structure which belongs to structural functional parts. According to different perforating parameters and honeycomb parameters, noise in a target frequency band can be reduced effectively.

Description

technical field [0001] The invention belongs to the technical field of aircraft nacelle noise reduction structure design, and in particular relates to a bonding method for a honeycomb sandwich structure of a micro-perforated plate. Background technique [0002] The general honeycomb bonding method is to directly brush the primer and film on the honeycomb panel, and then glue the honeycomb core and put it into an autoclave for curing. This method has simple steps, is easy to operate, and the process verification is a mature technology, which has been widely used in the bonding of general honeycombs. However, during the curing process of the adhesive film, if the honeycomb panel is a micro-perforated plate, the adhesive film laid on the panel will block a large number of micropores on the micro-perforated plate during the curing process. Therefore, the general honeycomb bonding method is not suitable for the bonding of micro-perforated panel honeycomb sandwich structures. C...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B32B37/06B32B38/18
Inventor 杨成茂
Owner XIAN AIRCRAFT DESIGN INST OF AVIATION IND OF CHINA
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com