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Covering film for flexible copper-clad plate, and single/double flexible copper-clad plate utilizing covering film

A flexible copper clad laminate and cover film technology, applied in layered products, metal layered products, synthetic resin layered products, etc., can solve problems such as improvement and line oxidation

Inactive Publication Date: 2014-03-05
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Higher pressing temperature will greatly increase the demand for pressing equipment, and under high temperature pressing conditions, the risk of line oxidation will be greatly increased

Method used

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  • Covering film for flexible copper-clad plate, and single/double flexible copper-clad plate utilizing covering film
  • Covering film for flexible copper-clad plate, and single/double flexible copper-clad plate utilizing covering film
  • Covering film for flexible copper-clad plate, and single/double flexible copper-clad plate utilizing covering film

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Embodiment Construction

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them.

[0026] A cover film for flexible copper clad laminates, see figure 1 , comprising a low-dielectric insulating base film layer 20 (D k 2.0~3.0, D f 0.001~0.015), the low dielectric insulating adhesive layer 30 (D k 2.3~3.0, D f 0.001-0.015) and the release material layer 40 , the low dielectric insulating base film layer 20 and the release material layer 40 are respectively covered on both sides of the low dielectric insulating adhesive layer 30 .

[0027] A single-sided flexible copper clad laminate, see figure 2, comprising a low dielectric insulating base film layer 20 and a copper foil layer 10, the copper foil layer 10 covering one side of the lo...

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Abstract

The invention relates to the technical field of a copper-clad plate, and in particular provides a covering film for a flexible copper-clad plate and a single / double flexible copper-clad plate utilizing the covering film. The covering film or the flexible copper-clad plate comprises a low-dielectric insulation base film layer of which the Dk is 2.0-3.0 and the Df is 0.001-0.015 and a low-dielectric insulation adhesive layer of which the Dk is 2.3-3.0 and the Df is 0.001-0.015; the covering film not only has high flexibility, low thickness and low Dk / Df but also has the press temperature being lower than 220 DEG C; a flexible circuit board prepared from the covering film has high-frequency and high-speed characteristics at the same time; the covering film is widely used for the fields of 3G / 4G smart phones, interphones, radar, base stations and the like.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a cover film for flexible copper clad laminates and single and double flexible copper clad laminates using the cover film. Background technique [0002] Flexible copper-clad laminate refers to a copper-clad laminate formed by bonding one or both sides of flexible insulating materials such as polyester film or polyimide film to copper foil through a certain process. Flexible copper clad laminates are widely used in aerospace equipment, navigation equipment, aircraft instruments, military guidance systems and mobile phones, digital cameras, digital video cameras, automotive satellite direction positioning devices, LCD TVs, notebook computers and other electronic products. Due to the rapid development of electronic technology, the output of flexible copper-clad laminates has grown steadily, and the production scale has continued to expand, especially for high-performan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/10B32B7/12B32B7/06B32B15/04
Inventor 周韶鸿茹敬宏
Owner GUANGDONG SHENGYI SCI TECH
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