Epoxy resin sealing adhesive

Abstract

The invention provides an epoxy resin sealing adhesive, relating to the technical field of adhesives. The adhesive is characterized by comprising the following components in parts by weight: 100 parts of epoxy resin, 10 parts of diluter, 30 parts of hexabromo-benzene, 15 parts of antimony trioxide, 150 parts of aluminum hydroxide, 80 parts of silicon micropowder, 90 parts of liquid methyl tetrahydrophthalic anhydride and 2 parts of 2-ethyl-4-methylimidazole. The components are cured by heating. The adhesive is simple in formula and convenient to manufacture, and has the advantages of excellent curing property and favorable technical properties.

Description

Technical field: [0001] The invention relates to the technical field of adhesives, in particular to an epoxy resin sealing adhesive. Background technique: [0002] Since the 1950s, with the development of the electronics industry towards miniaturization, light weight, and precision, epoxy potting adhesives have been widely used in the electronic component manufacturing industry and have become important insulating materials for the electronics industry. . There are some requirements for epoxy potting adhesives as follows. [0003] ① Low viscosity, good impregnation, can fill between components and wiring. [0004] ②The application period is long, suitable for the production operation of the automatic assembly line industry. [0005] ③ During the potting and curing process, the inorganic filler in the potting compound is not easy to settle and will not be stratified. [0006] ④The curing heat release is low and the shrinkage rate is small. [0007] ⑤ The cured product ha...

AI Technical Summary

Problems solved by technology

[0008] However, the epoxy potting adhesives in the prior art are generally two-component and can be cured at room temperature, but the use and performance are not ideal, the manufacturability is poor, and the curing comprehensive performance is poor.

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