Solder powder, and solder paste using solder powder

A technology of solder powder and solder, applied in the direction of welding/cutting medium/material, welding equipment, welding medium, etc., can solve the problems of time-consuming, poor yield, poor wettability, etc., and achieve easy control, fast melting, and wettability good sex effect

Active Publication Date: 2014-03-05
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the yield becomes very poor
On the other hand, if the powder is about 7 μm, the yield will be good even if this method is used, but the powder with this particle size cannot sufficiently cope with the finer pitch in recent years.
[0010] Furthermore, in the case of t

Method used

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  • Solder powder, and solder paste using solder powder
  • Solder powder, and solder paste using solder powder
  • Solder powder, and solder paste using solder powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] First, add copper(II) sulfate 2.54×10 to 50mL of water -4 mol, silver sulfate (I) 4.48×10 -4 mol, tin(II) sulfate 2.62×10 -2 mol, stirred with a stirrer at a speed of 300 rpm for 5 minutes to prepare a solution. After adjusting the pH of the solution to 0.5 with sulfuric acid, 0.5 g of polyvinyl alcohol 500 (polyvinyl alcohol having an average molecular weight of 500) was added as a dispersant, and stirred at 300 rpm for 10 minutes. Then, in this solution, add 50mL of 1.58mol / L divalent chromium ion aqueous solution that pH is adjusted to 0.5 with the addition speed of 50mL / sec, stir with the rotating speed of 500rpm for 10 minutes and reduce each metal ion, obtain in solution A dispersion in which metal powder is dispersed. After the dispersion was allowed to stand for 60 minutes to precipitate the generated metal powder, the supernatant was removed, and 100 mL of water was added thereto, followed by stirring at 300 rpm for 10 minutes. This operation was repeated 4 ...

Embodiment 2

[0054] First, add copper(II) sulfate 2.56×10 to 50mL of water -4 mol, silver sulfate (I) 6.04×10 -4 mol, tin(II) sulfate 2.62×10 -2 mol, stirred with a stirrer at a speed of 300 rpm for 5 minutes to prepare a solution. After adjusting the pH of the solution to 0.5 with sulfuric acid, 0.5 g of polyvinyl alcohol 500 was added as a dispersant, and stirred at 300 rpm for 10 minutes. Then, in this solution, add 50mL of 1.58mol / L divalent chromium ion aqueous solution that pH is adjusted to 0.5 with the addition speed of 50mL / sec, stir with the rotating speed of 500rpm for 10 minutes and reduce each metal ion, obtain in solution A dispersion in which metal powder is dispersed. After the dispersion was allowed to stand for 60 minutes to precipitate the generated metal powder, the supernatant was removed, and 100 mL of water was added thereto, followed by stirring at 300 rpm for 10 minutes. This operation was repeated 4 times for washing.

[0055] Thereafter, 100 mL of ethylene gl...

Embodiment 3

[0057] First, add copper(II) sulfate 9.86×10 to 50mL of water -5 mol, silver sulfate (I) 7.26×10 -5 mol, tin(II) sulfate 2.62×10 -2 mol, stirred with a stirrer at a speed of 300 rpm for 5 minutes to prepare a solution. After adjusting the pH of the solution to 0.5 with sulfuric acid, 0.5 g of polyvinyl alcohol 500 was added as a dispersant, and stirred at 300 rpm for 10 minutes. Then, in this solution, add 50mL of 1.58mol / L divalent chromium ion aqueous solution that pH is adjusted to 0.5 with the addition speed of 50mL / sec, stir with the rotating speed of 500rpm for 10 minutes and reduce each metal ion, obtain in solution A dispersion in which metal powder is dispersed. After the dispersion was allowed to stand for 60 minutes to precipitate the generated metal powder, the supernatant was removed, and 100 mL of water was added thereto, followed by stirring at 300 rpm for 10 minutes. This operation was repeated 4 times for washing.

[0058] Thereafter, 100 mL of ethylene gl...

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Abstract

A particle of this solder powder is configured of a core and a coat layer applied on the core, and has an average particle diameter of 5 [mu]m or less. The solder powder is characterized in that: the core is composed of an intermetallic compound of silver and tin or is composed of silver and an intermetallic compound of silver and tin; the coat layer is composed of tin; and an intermediate layer composed of an intermetallic compound of copper and tin is provided between the core and the coat layer such that at least a part of the core is covered.

Description

technical field [0001] The present invention relates to a lead-free solder powder for fine pitches and a solder paste using the powder. More specifically, it relates to a fine Sn-based solder powder having an average particle diameter of 5 μm or less, and a solder paste using the powder. Background technique [0002] From the environmental point of view, lead-free solder is being promoted for joining electronic components, and solder powder mainly composed of tin is currently used. As a method of obtaining fine metal powder such as solder powder, in addition to spraying methods such as gas spraying method and rotating disk method, melt spinning method, rotating electrode method, mechanical process, chemical process, etc. are known. The gas spraying method is a method in which the metal is melted in an induction furnace or a gas furnace, and then the molten metal is flowed down from a nozzle at the bottom of a tundish, and a high-pressure gas is sprayed around it to powder i...

Claims

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Application Information

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IPC IPC(8): B23K35/14B23K35/22B23K35/26B22F1/00B22F1/02B22F1/17
CPCB23K35/025B23K35/3006B22F1/00B23K35/262B23K35/22B23K35/26C22C2204/00B32B15/018B22F1/025B23K35/0244B22F1/02C22C9/02C22C13/00C22C5/06B32B15/01B22F1/17B23K35/0238C22C9/00C22C9/04Y10T428/12028C22C1/047
Inventor 中川将村冈弘树久芳完治川村洋辅
Owner MITSUBISHI MATERIALS CORP
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