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Manufacturing method for inner electrode of chip component

A manufacturing method and technology of components, applied in the manufacture of resistors, electrical components, capacitors, etc., can solve problems such as electrode deformation, silver paste waste, and environmental pollution

Inactive Publication Date: 2014-03-12
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The disadvantages of using the above method to make electronic components to make thin-line inner electrodes are: (1) Since the silver paste is printed on the entire surface first, and then the positions that do not need silver paste are washed away, the silver paste is wasted; (2) ) Since the above method needs to use chemical solution to clean and develop, it will pollute the environment; (3) Since the above method is to form electrodes on the surface of the tablet, there is a certain height difference between the electrode and the tablet, so that the subsequent lamination process is in the process of adding After pressing, the electrode will be at risk of being pressed and deformed

Method used

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  • Manufacturing method for inner electrode of chip component
  • Manufacturing method for inner electrode of chip component
  • Manufacturing method for inner electrode of chip component

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Embodiment Construction

[0025] The present invention will be further described below with reference to the accompanying drawings and in combination with preferred embodiments.

[0026] The embodiment of the present invention discloses a method for manufacturing high-precision ultra-fine internal electrodes of chip components, wherein the ceramic casting slurry in this embodiment is composed of glass powder, binder, dispersant, solvent and plasticizer. Specifically, the glass powder is MGA powder, the particle size D50 is 1-3 μm, and the binder can be Rohm and Haas Paraloid TM Laubola thermoplastic acrylic resin A-21, the dispersant can adopt high-performance phosphite antioxidant S9228, the solvent can adopt the mixture of ethyl acetate and isopropanol, and the plasticizer can adopt hexadiene Dioctyl acid.

[0027] The method for manufacturing high-precision ultra-fine inner electrodes of chip components in this embodiment includes the following steps:

[0028] (1) Prepare ceramic casting slurry by...

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Abstract

The invention discloses a manufacturing method for an inner electrode of a chip component. The manufacturing method comprises the following steps of firstly preparing ceramic tape casting slurry, and performing tape casting and drying on the ceramic tape casting slurry to form a ceramic raw sheet; engraving a trench on the ceramic raw sheet through a laser device; finally filling the trench with silver paste to form the inner electrode of the chip component. According to the inner electrode of the chip component, which is manufactured by the trench filling method, only the trench is filled with the silver paste, and the waste of redundant silver paste can be avoided; furthermore, cleaning and developing which are implemented by using a chemical solution are not needed, so that pollution to the environment is avoided.

Description

technical field [0001] The invention relates to the technical field of chip electronic components, in particular to a method for manufacturing internal electrodes of chip components. Background technique [0002] In recent years, with the advancement of science and technology, electronic components have been used more and more widely. The volume is also required to be smaller and smaller. [0003] The traditional method of making thin-line internal electrodes for electronic components is to first use screen printing to cover the area where the pattern needs to be printed with silver paste, and then use ultraviolet light to match the corresponding MASK board pattern to cure, develop, and wash it. Finally, the desired electrode pattern is formed. [0004] In addition, the patent document CN103395307A discloses a method for preparing internal electrodes of chip electronic components, which mainly includes: printing a preliminary internal electrode pattern with a negative phot...

Claims

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Application Information

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IPC IPC(8): H01C17/00H01G13/00H01F41/00
Inventor 覃杰勇王清华
Owner SHENZHEN SUNLORD ELECTRONICS
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