A kind of textile, its production method and application
A production method and textile technology, applied in the field of textiles, can solve problems such as unevenness, wrinkles, and poor surface particle uniformity, and achieve the effects of smooth surface, uniform particle size, and improved UV resistance.
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Embodiment 1
[0026] A method for fabricating fabrics, comprising the steps of:
[0027] A. The polypropylene cloth is cleaned and dried as the substrate, put into the magnetron sputtering device chamber, the reaction chamber is evacuated, and filled with high-purity argon as the reaction gas;
[0028] B. Use 99.99% metallic copper as the sputtering target;
[0029] C. Adjust the pressure to 0.5Pa, the power to 10W, and the gas flow rate to 20sccm, sputter a copper film on the polypropylene cloth substrate, and sputter for 5 minutes to obtain a polypropylene cloth with a single-layer copper film.
Embodiment 2
[0031] A method for fabricating fabrics, comprising the steps of:
[0032] A. The polypropylene cloth is cleaned and dried as the substrate, put into the magnetron sputtering device chamber, the reaction chamber is evacuated, and filled with high-purity argon as the reaction gas;
[0033] B. Use 99.99% metal copper as the target;
[0034] C. Adjust the pressure to 1Pa, the power to 20W, and the gas flow to 40sccm, sputter a copper film on the polypropylene cloth substrate, and sputter for 15 minutes to obtain a polypropylene cloth with a single-layer copper film.
Embodiment 3
[0036] A method for fabricating fabrics, comprising the steps of:
[0037] A. The polypropylene cloth is cleaned and dried as the substrate, put into the magnetron sputtering device chamber, the reaction chamber is evacuated, and filled with high-purity argon as the reaction gas;
[0038] B. Use 99.99% metallic copper as the sputtering target;
[0039] C. Adjust the pressure to 2Pa, the power to 30W, and the gas flow to 60sccm, and sputter a copper film on the polypropylene cloth substrate for 25 minutes to obtain a polypropylene cloth with a single-layer copper film.
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Abstract
Description
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