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LED lamp conducting light-guide and heat-dissipation through bundling optical fibers

A technology of LED lamps and LED chips, which is applied in the direction of light guides, light guides of lighting systems, semiconductor devices of light-emitting elements, etc., can solve the problem that epoxy resin has weak UV aging resistance, and the light transmittance in the visible light region is not as good as that of optical fibers and LED external quantum Efficiency reduction and other problems, to achieve the effect of improving external quantum efficiency, good anti-ultraviolet effect, and light weight

Active Publication Date: 2014-03-26
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, at present, bisphenol A transparent epoxy resin is mainly used for LED packaging, which is not as transparent as optical fiber in the visible light region, resulting in a decrease in the external quantum efficiency of the LED, thereby reducing the light efficiency and increasing the chip temperature.
Moreover, the ability of epoxy resin to resist ultraviolet aging is weak, and yellowing will occur in the ultraviolet environment for a long time, which will seriously affect the light transmittance.

Method used

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  • LED lamp conducting light-guide and heat-dissipation through bundling optical fibers
  • LED lamp conducting light-guide and heat-dissipation through bundling optical fibers
  • LED lamp conducting light-guide and heat-dissipation through bundling optical fibers

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Experimental program
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Effect test

Embodiment 1

[0026] Such as figure 1 As shown, the LED lamp of this embodiment includes an LED chip 1, a protective casing 2 and a plastic radiator 3, the shape of the protective casing 2 is hemispherical, a metal circuit layer 4 is provided on the top of the plastic radiator 3, and the outer edge is Several heat dissipation fins 5 are evenly arranged in the circumferential direction, and the material used in the metal circuit layer 4 is copper. The interval, number and thickness of the heat dissipation fins 5 can be calculated by theoretical formulas, and each heat dissipation fin The features of the sheets 5 are all the same; the LED chip 1 is welded on the metal circuit layer 4, and the protective shell 2 is sealed and buckled on the upper end of the plastic heat sink 3 to realize the packaging of the LED chip 1; the protective shell 2 is set There is a dome-shaped hollow structure 6, the LED chip 1 is located in the dome-shaped hollow structure 6, and the cavity 7 surrounded by the LED...

Embodiment 2

[0032] Such as figure 2 As shown, the main features of the LED lamp of this embodiment are: the shape of the protective shell 2 is semi-elliptical. All the other are with embodiment 1.

Embodiment 3

[0034] Such as image 3 As shown, the main features of the LED lamp of this embodiment are: the protective shell 2 is a solid structure, and its side facing the LED chip 1 is provided with a groove matching the shape of the LED chip 1 for accommodating the LED chip 1. The LED chip 1 is in close contact with the protective shell 2 without filling gas, and the LED chip 1 is directly packaged on the plastic heat sink 3 to meet the requirements of light distribution and heat dissipation; wherein, the shape of the protective shell 2 is hemispherical.

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Abstract

The invention discloses an LED lamp conducting light-guide and heat-dissipation through bundling optical fibers. The LED lamp comprises an LED chip, a protective outer shell and a plastic radiator, a metal circuit layer is arranged at the top of the plastic radiator, a plurality of heat-dissipating fins are evenly arranged at the outer side in the circumference direction of the plastic radiator, the LED chip is welded to the metal circuit layer, and the protective outer shell is of a structure manufactured through the bundling optical fibers and is buckled at the upper end of the plastic radiator in a sealed mode so that package of the LED chip can be achieved. According to the LED lamp conducting light-guide and heat-dissipation through the bundling optical fibers, the protective outer shell manufactured by the bundling optical fibers is used for packaging the LED chip; compared with epoxy resin, the heat-dissipating coefficient of the protective outer shell is higher; the LED lamp conducting light-guide and heat-dissipation through the bundling optical fibers has the advantages of being high in light-permeability, not prone to aging, good in uvioresistant effect and the like, the external quantum efficiency of the lamp is improved, the light efficiency is improved, and good heat-dissipation effect and stable device reliability are achieved; in addition, the bundling optical fibers have the oriented light-guiding capacity, secondary light distribution of the LED lamp is simplified, and the effect of oriented light output is achieved.

Description

technical field [0001] The invention relates to an LED lamp, in particular to an LED lamp which conducts light and dissipates heat through bundled optical fibers, and belongs to the technical field of LED heat dissipation. Background technique [0002] As a new type of energy-saving lighting body, LED has been widely used due to its small size, low driving voltage, fast response, good shock resistance, long service life and low environmental hazards. LED lamps generally require two light distribution designs. The first light distribution design is completed when the chip is packaged, and the second light distribution design needs to perform optical simulation and add lamp cups, reflectors and other equipment to achieve lighting effects. The process is complicated and excessive. cost. In addition, LED lamps will generate a lot of heat during operation. If the heat cannot be dissipated in time, the junction temperature will be too high, which will lead to problems such as sho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V15/02F21V8/00F21V29/00F21Y101/02F21K9/237F21V29/50F21V29/74F21V29/89F21Y115/10
Inventor 文尚胜黄伟明陈颖聪
Owner SOUTH CHINA UNIV OF TECH