Electromagnetic wave shielding member
A technology for shielding components and electromagnetic waves, which is applied in the field of multilayer moldings and their manufacture, can solve the problems of uneven parts, bent parts, and high elastic modulus that are difficult to apply to electronic instruments, and achieve excellent flexibility, excellent flexibility, and reliability high effect
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no. 1 approach
[0050] figure 1 It is a schematic cross-sectional view showing an example of the multilayer molded article of the first embodiment. figure 1 The multilayer molded article 1 is composed of a laminated body of an adhesion-enhancing resin layer 11 and a binder resin / filler composite 21 . A binder resin / filler composite 21 is laminated on one main surface of the adhesiveness enhancing resin layer 11 . Adhesion-enhancing resin layer 11 functions as a support for binder resin / filler composite 21 . The binder resin / filler composite 21 has a heat dissipation function.
[0051] The multilayer molded body 1 can be suitably used as a heat dissipation member. The heat dissipation member may be the multilayer molded body 1 itself, or may be composed of the multilayer molded body 1 and other members. Other components are, for example, metal platinum, a substrate, and the like. The substrate can be made of silicon, ceramics, resin, or metal. Examples of metals include copper, aluminum,...
no. 2 approach
[0125] Next, an example of a multilayer molded article different from the above-mentioned embodiment will be described. The multilayer molded article of the second embodiment has the same basic configuration as that of the above-mentioned first embodiment except for the following points. That is, there is a difference in that the multilayer molded article of the first embodiment has only one adhesiveness-enhancing resin layer, while the multilayer molded article of the second embodiment has two adhesiveness-enhancing resin layers. Floor.
[0126] Figure 4 It is a schematic cross-sectional view of an example of the multilayer molded article of 2nd Embodiment. The multilayer molded body 2 has a structure in which a binder resin / filler composite 21 is sandwiched between the adhesiveness enhancing resin layers 11 and 12 .
[0127] According to the multilayer molded body 2, since the binder resin / filler composite 21 is sandwiched between the adhesiveness enhancing resin layers ...
no. 3 approach
[0130]The multilayer molded article of the third embodiment has the same basic configuration as that of the above-mentioned first embodiment except for the following points. That is, there is a difference in that the multilayer molded article of the first embodiment is used for a heat dissipation member, whereas the multilayer molded article of the third embodiment is used for an electromagnetic wave shielding member.
[0131] The inorganic filler constituting the binder resin / filler composite of the multilayer molded article of the third embodiment is a filler having electromagnetic wave shielding properties. As such examples, metals, metal oxides, amorphous carbon powder, graphite, metallized fillers may be used. The metal may, for example, be copper, aluminum, nickel, iron, gold, silver, platinum, tungsten, chromium, titanium, tin, lead or palladium. These may be used alone or in combination of two or more. In addition, a soft magnetic filler can also be used as the fille...
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Abstract
Description
Claims
Application Information
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