Packaging structure

Abstract

The invention discloses a packaging structure. The packaging structure comprises: a circuit carrier board, wherein the circuit carrier board comprises a first surface and a second surface which is opposite to the first surface, the circuit carrier board is provided with a plurality of bearing units which are arranged in a matrix manner, first surfaces of the bearing units are provided with a plurality of input bonding pads, second surfaces of the bearing units are provided with a plurality of output bonding pads, and the input bonding pads and the output bonding pads are connected through an interconnection structure; a pre-packaged panel, wherein the pre-packaged panel comprises a first plastic packaged layer, a plurality of integrated unit which are arranged in a matrix manner are arranged in the first plastic packaged layer, at least one semiconductor chip is arranged in each integrated unit, surfaces of the semiconductor chips are provided with a plurality of bonding pads, the bonding pads are provided with first metal bumps, the pre-packaged panel is arranged on the first surface of the circuit carrier board in a flipping manner, and the first metal bumps and the input bonding pad are soldered together; a filling layer for filling the space between the first surfaces of the bearing units and the pre-packaged panel; and second metal bumps located on the output bonding pads of the second surfaces of the bearing units. According to the packaging structure of the invention, the integration level is improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a packaging structure. Background technique [0002] With the development of electronic products such as mobile phones and notebook computers towards miniaturization, portable, ultra-thin, multimedia and low-cost to meet the needs of the public, the traditional single-chip packaging technology can no longer meet the increasingly novel market demand. Packaging technology with light, thin, short and small product characteristics, high density and low cost has become the mainstream of market research. Among the various packaging technologies at present, POP (package on package) and PIP (package in package) packaging technologies are typical representatives. [0003] Taking the POP packaging technology as an example, the volume and thickness of the entire packaging structure can be reduced by stacking semiconductor chips on a circuit carrier. [0004] The packaging efficiency...

AI Technical Summary

Problems solved by technology

[0004] The existing POP packaging technology has low packaging efficiency when forming a packaging structure

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