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Engineering plastic applicable to LDS (Laser Direct Structuring) forming process as well as preparation method and application thereof

A technology for engineering plastics and molding process, applied in the field of engineering plastics and their preparation, can solve the problems of poor laser inducibility and physical and mechanical properties of engineering plastics, achieve good laser inducibility and mechanical properties, reduce processing procedures, and reduce production costs Effect

Inactive Publication Date: 2014-04-30
ANHUI KEJU NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, to provide a kind of engineering plastics suitable for LDS molding process and its preparation, to solve the existing poor technology of laser induction and physical mechanical properties of engineering plastics suitable for LDS molding process question

Method used

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  • Engineering plastic applicable to LDS (Laser Direct Structuring) forming process as well as preparation method and application thereof
  • Engineering plastic applicable to LDS (Laser Direct Structuring) forming process as well as preparation method and application thereof
  • Engineering plastic applicable to LDS (Laser Direct Structuring) forming process as well as preparation method and application thereof

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preparation example Construction

[0037] Correspondingly, the embodiment of the present invention also provides a preparation method of the engineering plastics suitable for the LDS molding process, the method includes the following steps:

[0038] Correspondingly, the embodiment of the present invention also provides a preparation method of the above-mentioned nitrile rubber / EPDM rubber aging-resistant material. The method comprises the steps of:

[0039] S01. Weigh the formula components: Weigh each component according to the component content of the engineering plastics suitable for the LDS molding process described above;

[0040] S02. Melting and extruding after mixing each component: performing mixing and extruding each component weighed in step S01.

[0041]Specifically, the components of the engineering plastics suitable for the LDS molding process in the above-mentioned step S01 and the preferred content and type of each component are as described above, wherein the preparation method of the laser-ac...

Embodiment 1

[0049] Engineering plastics suitable for LDS molding process and preparation method thereof. Wherein, the engineering plastics suitable for the LDS molding process contains the following components:

[0050] PC70.0%, ABS15.8%, coupling agent-treated laser activator 5.0%, compatibilizer 3.0%, toughening agent 5.0%, lubricant 0.5%, antioxidant 0.4%, heat stabilizer 0.3%. Among them, the coupling agent in the laser activator treated by the coupling agent is γ-aminopropyltriethoxysilane, and the laser activator is AB 2 o 4 ; The compatibilizer is ABS grafted maleic anhydride ABS-g-MAH, the toughening agent is toughening agent E518, the lubricant is EBS120, and the antioxidant is tetrakis[3-(3,5-di-tert-butyl-4 -Hydroxyphenyl)propionic acid]pentaerythritol ester and tris(2,4-di-tert-butylphenyl phosphite) in a weight ratio of 1:1, and the heat stabilizer is an organic copper composite heat stabilizer.

[0051] Its preparation method:

[0052] Preparation of laser-activated mate...

Embodiment 2

[0055] Engineering plastics suitable for LDS molding process and preparation method thereof. Among them, the engineering plastic suitable for LDS molding process contains the following components:

[0056] PC55.0%, ABS15.8%, coupling agent treated laser activator 20.0%, compatibilizer 3.0%, toughening agent 5.0%, lubricant 0.5%, antioxidant 0.4%, heat stabilizer 0.3%.

[0057] Among them, the coupling agent in the laser activator treated by the coupling agent is γ-methacryloxypropyl trimethoxysilane, and the laser activator is AB 2 o 4 ; The compatibilizer is SMA, the toughening agent is toughening agent E518, the lubricant is EBS120, and the antioxidant is triethylene glycol bis-3-(3-tert-butyl-4-hydroxy-5-methylphenyl) Acrylonitrile, the heat stabilizer is an organotin heat stabilizer.

[0058] Its preparation method:

[0059] Preparation of laser-activated material treated with coupling agent: dry the laser-activated material at 100°C for 3 hours and then place it in th...

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Abstract

The invention discloses an engineering plastic applicable to an LDS (Laser Direct Structuring) forming process, as well as a preparation method and an application of the engineering plastic. The engineering plastic comprises the following components in percentage by weight: 45.0-80.0% of PC (Polycarbonate) resin, 7.8-15.0% of ABS (Acrylonitrile Butadiene Styrene) resin, 5.0-40.0% of laser activator treated by using a coupling agent, 2.5-5.5% of compatilizer, 4.0-7.0% of toughening agent, 0.5-1.0% of lubricant, 0.1-1.0% of antioxidant and 0.1-1.0% of thermal stabilizing agent. The preparation method comprises steps of mixing treatment and melting and extrusion treatment. The engineering plastic applicable to an LDS forming process is excellent in laser induction mechanical property, is simple in preparation method process, easy for controlling the conditions and low in cost, and can be widely applied to preparation of antennas, electronic circuits, automatic teller machine shells and medical hearing aids.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to an engineering plastic suitable for an LDS molding process and a preparation method and application thereof. Background technique [0002] Laser direct structuring (LDS) technology is a technology developed by German LPKF company, which has been widely used in the production process of mobile phone antennas. LDS technology uses a laser to carve antenna circuit traces on the surface of thermoplastic composite components, and activates the organometallic additives in this thermoplastic material by laser, exposing the metal particles in the organic metal additives, such as copper particles, to the components The surface of the circuit trace, and finally the laser-activated part of the component, that is, the surface of the circuit trace, is metal-plated, thereby forming a mobile phone antenna of a specific shape on the surface of the component. It provides hig...

Claims

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Application Information

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IPC IPC(8): C08L69/00C08L55/02C08K13/06C08K9/06C08K9/04C08K3/22B29C47/92B29C48/92
Inventor 徐东许江威
Owner ANHUI KEJU NEW MATERIALS
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