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A processing technology of sapphire mobile phone screen cover

A mobile phone screen and processing technology, applied in the directions of crystal growth, post-processing details, post-processing, etc., can solve the problems of low strength of sapphire screen cover plate, limit the large-scale popularization and application of sapphire products, etc., and achieve the effect of improving strength

Active Publication Date: 2016-04-06
GUANGDONG FUYUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The surface damage layer, the edge damage layer and the edge sand mouth are the starting points of crack failure of sapphire products under the action of external force. The surface damage layer, edge damage layer and edge sand mouth are not processed after cornering, so the strength of the sapphire screen cover plate for mobile phone produced by the current traditional sapphire processing technology is far lower than the theoretical strength of sapphire material, which limits the strength of sapphire. Large-scale popularization and application of products in consumer electronics such as mobile phones

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024](1) The sapphire blank is formed, place the sapphire blank on the fixture of the CNC machine, select a 600-mesh, 90° diamond chamfering grinding head, set the grinding head running track coordinates according to the shape of the sapphire blank, and set the speed at 800 rpm / min, the feed is 0.05 / min, the moving speed of the grinding head is 60mm / min, the removal amount of each side of the sapphire blank is 0.1mm, and the molding time is 20 minutes;

[0025] (2) Chamfering, place the sapphire blank on the fixture of the CNC machine, select a 45° diamond chamfering grinding head with a surface roughness of 800 mesh, set the speed at 600 rpm, and feed at 0.02mm / min, the moving speed of the grinding head is 60mm / min, the amount of chamfering is 0.1mm, and the chamfering time is 8 minutes, and the semi-finished sapphire mobile phone cover is made;

[0026] (3) Grinding, cleaning the semi-finished sapphire mobile phone cover plate after chamfering, placing the semi-finished s...

Embodiment 2

[0031] (1) The sapphire blank is formed, place the sapphire blank on the fixture of the CNC machine, select a 700-mesh, 90° diamond chamfering grinding head, set the grinding head running track coordinates according to the shape of the sapphire blank, and set the speed to 900 rpm / min, the feed rate is 0.06 / min, the moving speed of the grinding head is 70mm / min, the removal amount of each side of the sapphire blank is 0.1mm, and the molding time is 15 minutes;

[0032] (2) Chamfering, place the sapphire blank on the fixture of the CNC machine, select a 45° diamond chamfering grinding head with a surface roughness of 900 mesh, set the speed at 700 rpm, and feed at 0.04mm / min, the moving speed of the grinding head is 70mm / min, the amount of chamfering is 0.1mm, and the chamfering time is 6 minutes, and the semi-finished sapphire mobile phone cover is made;

[0033] (3) Grinding, cleaning the semi-finished sapphire mobile phone cover plate after chamfering, placing the semi-fini...

Embodiment 3

[0038] (1) The sapphire blank is formed, place the sapphire blank on the fixture of the CNC machine, select the 800-mesh, 90° diamond chamfering grinding head, set the trajectory coordinates of the grinding head according to the shape of the sapphire blank, and set the speed to 1000 rpm / min, the feed is 0.08 / min, the moving speed of the grinding head is 75mm / min, the removal amount of each side of the sapphire blank is 0.1mm, and the molding time is 10 minutes;

[0039] (2) Chamfering, place the sapphire blank on the fixture of the CNC machine, select a 45° diamond chamfering grinding head with a surface roughness of 1000 mesh, set the speed at 800 rpm, and feed at 0.05mm / min, the moving speed of the grinding head is 80mm / min, the amount of chamfering is 0.1mm, and the chamfering time is 5 minutes, and the semi-finished sapphire mobile phone cover is made;

[0040] (3) Grinding, cleaning the semi-finished sapphire mobile phone cover plate after chamfering, placing the semi-f...

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Abstract

The invention discloses a machining process of a sapphire material mobile phone screen cover plate, belonging to the technical field of sapphire machining processes. The machining process is technically characterized by comprising the following steps: (1), forming a sapphire blank; (2), chamfering; (3), grinding; and (4), performing surface polishing to prepare the sapphire material mobile phone screen cover plate, wherein between the grinding procedure and the surface polishing procedure, the machining process further comprises the following procedures: (a), etching the surface by plasmas to remove a damaged layer and a stress; and (b), corroding the edge by a solution. The invention aims to provide a machining process of the sapphire material mobile phone screen cover plate capable of greatly improving the strength of sapphire. The machining process is used in machining of the sapphire material mobile phone screen cover plate.

Description

technical field [0001] The invention relates to a sapphire processing technology, more specifically, to a processing technology of a sapphire mobile phone screen cover. Background technique [0002] Due to its high hardness (hardness of 9 is second only to diamonds), wear resistance, and high transmittance, sapphire has been gradually used in mobile phone camera protection covers, mobile phone fingerprint sensor buttons and mobile phone touch screen covers. The sapphire material is a single crystal with crystal orientation, and different crystal orientations have different physical and chemical properties. The crystal direction of sapphire includes C direction, A direction and R direction, etc. The plane perpendicular to the crystal direction is called C plane, A plane and R plane correspondingly. [0003] At present, the working surfaces of sapphire components used in the mobile phone industry mainly use the A and C surfaces of the crystal. The theoretical bending strengt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B33/12C30B33/10
Inventor 杜彦召
Owner GUANGDONG FUYUAN TECH CO LTD
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