Microchannel phase-change heat transfer device

A phase-change heat and micro-channel technology, applied in the field of thermal management, can solve the problems that the thickness of the liquid film cannot change with the change of the heat flux density, and cannot adapt to the change of the heat flux density of the heating device, so as to improve the heat extraction capacity and reduce the The effect of superheat and low temperature

Active Publication Date: 2014-05-28
INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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Problems solved by technology

[0007] In view of the above technical problems, the present invention provides a micro-channel phase-change heat device to solve the problem that once the micro-channel structure size is determined in the prior art micro-channel phase-change heat device, the thickness of the liquid film cannot change with the heat flux. And change, can not adapt to the technical problem of the heat flux density change of the heating device

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[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are forms known to those of ordinary skill in the art. Additionally, while illustrations of parameters including particular values ​​may be provided herein, it should be understood that the parameters need not be exactly equal to the corresponding values, but rather may approximate the corresponding values ​​within acceptable error margins or design constraints. The directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the...

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Abstract

The invention provides a microchannel phase-change heat transfer device. The microchannel phase-change heat transfer device includes an outer heat dissipation body and a microchannel heat sink; the outer heat dissipation body is of a cylindrical structure of which one side is closed; the microchannel heat sink is made of a shape memory alloy material and is of a platy structure; the microchannel heat sink is embedded at one un-closed end of the cylindrical structure of the outer heat dissipation device, such that a closed cavity can be formed; and the closed cavity is filled with a liquid working medium; a surface of the microchannel heat sink, which faces the inner side of the closed cavity, is provided with a plurality of hundred-micron-level microchannels; trained micro ribs are located between every two adjacent microchannels; and the depth of the microchannels above a preset temperature is greater than the depth of the microchannels below the preset temperature. With the microchannel phase-change heat transfer device of the invention adopted, the heat removal ability of a microchannel structured surface can be improved, and the overheating degree of the microchannel structured surface can be reduced, and therefore, the temperature of a heat-emitting device can be controlled to be lower.

Description

technical field [0001] The invention relates to the technical field of thermal management of electric power, electronics and optoelectronic devices, in particular to a micro-channel phase conversion heat device. Background technique [0002] With the improvement of the integration of high-power electric, electronic and optoelectronic devices, the heat flux density of the devices is also increasing. If the heat generated during the working process of these devices cannot be taken away in time, their performance and life will be greatly affected. Impact. Taking microelectronic chips as an example, with the improvement of chip integration, the heat flux density has reached hundreds of watts per square centimeter. Under such high heat flux conditions, traditional forced air cooling or single-phase liquid cooling Due to the limited heat extraction capacity of the traditional cooling method, it is difficult to meet the heat dissipation requirements of the device; on the other han...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H01L23/373
Inventor 姜玉雁王涛唐大伟
Owner INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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