Scribing wheel, and method for manufacturing the same

Abstract

The invention relates to a method for manufacturing a scribing wheel; the method comprises the following steps: forming a V-shaped knife front end on an annular portion of a scribing wheel substrate in a round plate shape; forming a diamond film doped with conductive impurities on the knife front end through a CVD method; providing power supply between the scribing wheel with the diamond film and a grindstone; detecting a reference zero point of grinding; grinding a ridge portion of the diamond film to be parallel with the ridge, and sharpening the front end. Because the diamond film is conductive, so grinding or groove processing can be easily carried out; the invention also provides the scribing wheel; by employing the method, grinding and groove processing of the scribing wheel can be simplified on the scribing wheel with a surface provided with a diamond film.

Description

technical field [0001] The invention relates to a scribing wheel used for crimping, rotating and scribing a brittle material substrate and its manufacturing method. Background technique [0002] A conventional scribing wheel uses a disc made of cemented carbide or polycrystalline sintered diamond (hereinafter referred to as PCD) as a base material, as disclosed in Patent Document 1 and the like. PCD discs are formed by sintering diamond particles together with cobalt (Co) and the like. The scoring wheel is formed by cutting the edge of the circumference obliquely from both sides of the circular plate used as the base material, and forming a V-shaped blade tip on the peripheral surface. The scribing wheel formed in this way is rotatably mounted on the scribing head of the scribing device, and pressed against the brittle material substrate with a predetermined load to move along the surface of the brittle material substrate. Turn side to score. [0003] Patent Document 2 di...

AI Technical Summary

Problems solved by technology

However, in the conventional scoring wheel formed by PCD, due to the size of the diamond particles contained in the material, the thickness of the tip of the knife and the ridge line are relatively thick, and it is difficult to set it below a certain level by grinding. Therefore, there is a disadvantage that the end surface strength of the brittle material substrate is reduced after the brittle material substrate is scratched and broken.

[0005] The glass cutting blade described in Patent Document 2 grinds the diamond film, but since the diamond film is not conductive, zero point detection, which becomes the reference position during grinding, cannot be performed by energization.

Therefore, during the polishing of the diamond coating, there is a large deviation in the starting point of the polishing due to the operator.

In particular, when the thickness of the diamond coating is thin and the polishing operation is performed at a few μm to 10 μm, there is a problem that the influence is large and the workability during processing is not good.

Images