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Resin composition, and film formation method using same

A technology of resin composition and main component, applied in the field of resin composition, can solve problems such as substrate or film warpage, and achieve the effects of less warpage, high glass transition temperature, and excellent storage stability

Inactive Publication Date: 2014-06-04
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, it has been pointed out that when a film is formed on a support such as a glass substrate using the above-mentioned conventional polyimide-forming composition, the substrate or the film itself warps due to shrinkage deformation during film formation.

Method used

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  • Resin composition, and film formation method using same
  • Resin composition, and film formation method using same
  • Resin composition, and film formation method using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0315] In a three-neck flask equipped with a thermometer, a nitrogen inlet tube and a stirring blade, add 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl (TFMB ) 15.3050g (0.0478mol), side-chain phenyl-methyl type silicone X-22-1660B-3 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) through amino modification at both ends [4.2925g (0.000976mol )], and 184.527 g of dehydrated cyclohexanone (CHN) added so that the concentration of the polyimide precursor in the resin composition became 14%, and stirred for 10 minutes until a completely uniform solution was obtained. 10.3997 g (0.047679 mol) of pyromellitic dianhydride (PMDA) was added thereto, and stirred for 60 minutes to complete the reaction. Then, microfiltration was performed using a filter made of polytetrafluoroethylene (pore diameter: 1 μm), thereby Resin composition 1 was produced.

[0316] (Moles of PMDA / (Moles of TFMB+Moles of X-22-1660B-3)=0.977 equivalent)

[0317] [Formation method of film after drying]...

Embodiment 2

[0327] Use TFMB (12.6570g) and 2.0370g of 4,4'-diaminodiphenyl ether (ODA) instead of TFMB (15.3050g), and change X-22-1660B-3, PMDA and CHN as shown in Table 1 Resin composition 2 was obtained similarly to Example 1 except the usage-amount.

[0328] Moreover, the dried film was formed by the method similar to Example 1 except having used the resin composition 2 instead of the resin composition 1.

[0329] Furthermore, the polyimide film was formed by the method similar to Example 1 except having changed the secondary drying temperature into 300 degreeC using the resin composition 2 instead of the resin composition 1.

Embodiment 3

[0331] Use CHN147.622g and γ-butyrolactone 36.905g instead of CHN184.527g, and change the usage amount of TFMB, X-22-1660B-3 and PMDA as shown in Table 1, except that it is the same as Example 1 The operation was carried out to obtain a resin composition 3 .

[0332] Moreover, except having used the resin composition 3 instead of the resin composition 2, the film after drying and the polyimide film were formed by the method similar to Example 2.

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Abstract

Provided is a resin composition that contains a structural unit represented by formula (2), a polyimide precursor which has a structural unit represented by formula (1), and a solvent mainly comprising a non-amide-based solvent. (In formula (1), the R groups are each independently a hydrogen atom or a monovalent organic group, the R1 groups are each independently a divalent organic group, the R2 groups are each independently a tetravalent organic group, and n is a positive integer. However, at least either of R1 and R2 contains a halogen atom or a haloalkyl group.) (In formula (2), the plurality of R5 groups are each independently a monovalent organic group having 1 to 20 carbon atoms, and m is an integer between 3 and 200.)

Description

technical field [0001] The present invention relates to a resin composition and a film forming method using the same. Background technique [0002] In general, wholly aromatic polyimides obtained from aromatic tetracarboxylic dianhydrides and aromatic diamines have excellent heat resistance and mechanical properties due to molecular rigidity, stable molecular resonance, and strong chemical bonds. , In the fields of electrical, battery, automobile, and aerospace industries, the polyimide or polyimide-forming composition is widely used as a raw material for films, coating agents, molding members, and insulating materials. [0003] However, it has been pointed out that when a film is formed on a support such as a glass substrate using the above-mentioned conventional polyimide-forming composition, the substrate or the film itself warps due to shrinkage deformation during film formation. . [0004] Here, Patent Document 1 discloses a polyimide precursor resin composition for f...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18
CPCC08G73/1067C09D179/08C08L79/08C08G73/1042C08G73/1039C08G73/106
Inventor 清水崇文藤冨晋太郎宫木伸行江利山祐一
Owner JSR CORPORATIOON