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Wiring board

A technology for wiring boards and internal components, applied in printed circuit components, printed circuits connected with non-printed electrical components, electrical components, etc.

Inactive Publication Date: 2014-06-04
YAZAKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, the insulating layer 190 is formed on the electronic part 80, and the insulating layer 190 cannot be made thin in consideration of the thickness of the part main body 85, which causes a problem that the overall thickness of the final board increases.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] like image 3 In the middle, the substrate substrate 10 is composed of the following part: installation of the part of the component at the center of the surface of the substrate substrate 10 arranged in the icon;The wiring area is 11A to 11C; and the peripheral framework of the outer side 12 of the peripheral slot 12.The interconnection part 18 is set between the outer peripheral framework 19 and the first to third wiring area 11A to 11C, so that the bridge is connected to the peripheral slot 12.The part of the component of the substrate substrate vertically through the part of the substrate substrate 15 is formed at the center of the three inner grooves 13 of the substrate substrate 10.

[0049] Component installation Touch pads 20 surround parts layout opening 15 forms and forms in the outer edge area of the component layout opening 15.Component installation pad 20 has the first to 23 of the first to the third touch pad, and the first to the third terminal of the electron...

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PUM

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Abstract

A wiring board comprises a base substrate (10) that is a metal core (31) substrate, and including an opening (15) in which an interior component (80) that is an electric component or an electronic component is to be mounted, and a terminal placement section (21-23) on which a terminal (81,83) of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.

Description

Technical field [0001] The present invention involves an electrical part or electronic component as an internal component on the wiring board, and more specifically, it involves a wiring board using the metal core plate that uses the metal plate from the insulating layer. Background technique [0002] Metal core plates can be used as a variety of electrical parts or electronic components to date to be installed on it.In the metal core plate, the insulation layer is set on the top surface and the bottom surface of the metal core made of the metal plate, and the wiring layer (conductive layer) layer is pressed on the various insulation layers.In the metal substrate, the heat generated by electrical or electronic components is dispersed by the metal core (see, for example, PTL1). [0003] figure 1 It shows the perspective view of the substrate substrate 110 that can be installed as an electronic component on it. Figure 2A to Figure 2C The electronic component 80 as the FET (field ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/05H05K1/02H05K3/30
CPCH05K2201/09972H05K2201/09745H05K1/182H05K2203/0169H05K1/056H05K2203/0323H05K2201/09472H05K1/05H05K1/11H05K1/183H05K2201/10439
Inventor 高木祐介
Owner YAZAKI CORP