PCB (printed circuit board) drying machine
A dryer and plate technology, used in progressive dryers, dryers, drying solid materials, etc., can solve problems such as no good results, and achieve increased air pressure, high water removal and drying efficiency, and increased temperature. Effect
Active Publication Date: 2014-06-11
SHENNAN CIRCUITS
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- Application Information
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Problems solved by technology
Since the upper and lower air knives are arranged perpendicular to the conveying direction of the conveyor belt, there is no good effect on the water column in the small hole, especially the water column in the small hole forming a sealed structure.
Method used
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[0018] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.
[0019] refer to figure 1 As shown, the present invention provides a PCB dryer, which includes a conveying roller assembly 2 for conveying a board 1 and is arranged on both sides of the board 1 conveyed by the conveying roller assembly 2 for blowing away the accumulation on the board 1 Air knife assembly for water3.
[0020] The conveying roller assembly 2 includes a frame 20 and a plurality of pairs of conveying rollers 22 disposed on the frame 20 . In order to improve the performance of water removal and drying, the conveying roller assembly 2 also includes a water-absorbing suction roller 23, which is located at the feeding end of the panel and is used to initially blow away the acc...
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The invention discloses a PCB (printed circuit board) drying machine, which comprises a transmission roller assembly and wind cutter assemblies, wherein the transmission roller assembly is used for transmitting plates, the wind cutter assemblies are arranged at the two sides of the plates transmitted by the transmission roller assembly and are used for blowing away water accumulated on the plates, each wind cutter assembly comprises a first upper wind cutter, a second upper wind cutter and a first lower wind cuter, the first upper wind cutter and the second upper wind cutter are sequentially arranged above the transmission roller assembly in the plate transmission direction of the transmission roller assembly, the first lower wind cutter is arranged under the transmission roller assembly in a way of corresponding to the second upper wind cutter, and an included angle between the airflow blowing direction of the first wind cutter and the plate transmission direction is not greater than 10 degrees, so a negative pressure zone is formed in an included angle region of the airflow and the plates. The negative pressure is formed according to the spraying type vacuum generating principle for sucking water columns in small holes, the water columns in the small holes can be effectively removed through blowing and sucking, and the water removal drying efficiency is high. The PCB drying machine has the advantages that the drying requirement of high multilayer high thickness-to-diameter ratio plates in the production and manufacturing processes can be met, the air pressure increase, the temperature rise and the drying time prolonging are not needed, and a great number of energy sources can be saved.
Description
technical field [0001] The invention relates to a PCB production line equipment, in particular to a PCB dryer. Background technique [0002] The multilayer printed circuit board (PCB) production process has more than ten wet processing steps. In order to ensure that the board is not oxidized during the flow between different processing steps, a The platform drying section is used to dry the surface and the moisture in the pores of the wet-treated board. [0003] With the improvement of PCB board structure requirements and the development of manufacturing technology, the thickness of high-layer PCB boards is increasing, the diameter of the process holes on the board is getting smaller and smaller, and the processing environment of the board material on the process The requirements are also getting higher and higher, so the water column adsorbed in the small holes is more difficult to be blown out. In the prior art, the water is slowly evaporated by increasing the wind press...
Claims
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Login to View More IPC IPC(8): F26B15/12F26B21/00F26B25/02
Inventor 陶仁杰
Owner SHENNAN CIRCUITS