Fluorescent-powder setting method and manufacturing method of light-emitting diode

A technology of phosphor powder and light-emitting layer, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of uneven mixing and distribution of blue and yellow light, affecting the normal use of light-emitting diodes, etc.

Inactive Publication Date: 2014-06-25
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Since the phosphor is directly doped in the package, it is prone to local deposition before the package is cured, resulting in uneven distribution, which in turn leads to uneven mixi

Method used

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  • Fluorescent-powder setting method and manufacturing method of light-emitting diode
  • Fluorescent-powder setting method and manufacturing method of light-emitting diode
  • Fluorescent-powder setting method and manufacturing method of light-emitting diode

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Embodiment Construction

[0019] See Figure 1-5 , Shows a phosphor setting method of an embodiment of the present invention. The method mainly includes the following steps:

[0020] First, like figure 1 As shown, a wafer 10 is provided. The wafer 10 includes a substrate 20 and a plurality of epitaxial structures 30 formed on the top surface of the substrate 20. The substrate 20 can be made of sapphire, silicon carbide and other materials, and is used to provide a supporting environment for the growth of the epitaxial structure 30. Each epitaxial structure 30 includes a first semiconductor layer 32, a second semiconductor layer 34, a light-emitting layer 36, a first electrode 38, and a second electrode 39. In this embodiment, the first semiconductor layer 32 is an N-type gallium nitride layer, the second semiconductor layer 34 is a P-type gallium nitride layer, and the light-emitting layer 36 is a multiple quantum well gallium nitride layer. The light-emitting layer 36 can be excited by the current to ...

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Abstract

Disclosed is a fluorescent-powder setting method which includes: providing a wafer which includes a substrate and epitaxial structures formed on the substrate, wherein each epitaxial structure includes a first semiconductor layer, a second semiconductor layer, a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, a first electrode formed on the first semiconductor layer, and a second electrode formed on the second semiconductor layer; forming separated light-resistance structures which cover the first electrodes and the second electrodes respectively; covering the epitaxial structures and the light-resistance structures with a continuously distributed fluorescent power; removing part of the fluorescent power so as to expose the light-resistance structures; and removing the light-resistance structures and then exposing the first electrodes and the second electrodes outside. The fluorescent-powder setting method is capable of realizing uniform distribution of the fluorescent powder so that a phenomenon that color cast occurs in synthetic light is prevented. The invention also provides a manufacturing method for a light-emitting diode.

Description

Technical field [0001] The invention relates to a setting method, in particular to a phosphor setting method and a light emitting diode manufacturing method using the coating method. Background technique [0002] As an emerging light source, light-emitting diodes have been widely used in various applications. In the existing light emitting diode, yellow phosphor is doped in a package covering a blue light emitting chip, and the blue light emitted by the chip excites the phosphor to generate yellow light to mix white light. Because the phosphor is directly doped in the package body, the phenomenon of local deposition is likely to occur before the package body is not cured, resulting in uneven distribution, resulting in uneven mixing of blue and yellow light, and color cast of the white light emitted by the LED The phenomenon affects the normal use of light-emitting diodes. Summary of the invention [0003] Therefore, it is necessary to provide a method for uniformly arranging pho...

Claims

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Application Information

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IPC IPC(8): H01L33/50
CPCH01L33/50H01L2933/0041
Inventor 赖志成
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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