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Dual-Port SRAM Connection Structure

A technology for contacting components and devices, used in static memory, instruments, electrical components, etc., to solve problems such as critical dimension uniformity bottlenecks, affecting SRAM cell stability, and limiting scaling

Active Publication Date: 2014-07-09
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the U-shaped gate structure includes potential issues with pull-down (PD) device variations and integration issues with fin field effect transistor (FinFET) structures
Also, critical dimension uniformity (CDU) in the U-shaped gate structure causes bottleneck and leakage issues
Accordingly, the U-shaped gate structure affects SRAM cell stability and limits scaling (or shrinking) capabilities

Method used

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  • Dual-Port SRAM Connection Structure
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Examples

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Embodiment Construction

[0037] It should be understood that the following summary provides a number of different embodiments, or examples, for implementing different features of the various embodiments. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. Additionally, the present invention may repeat reference numerals and / or letters in multiple instances. This repetition is for simplicity and clarity, and does not in itself dictate a relationship between the various embodiments and / or structures discussed.

[0038] figure 1 is a schematic diagram of a dual-port (DP) SRAM cell 100 constructed in accordance with aspects of the present invention in one embodiment. In one embodiment, DP SRAM cell 100 includes a Fin Field Effect Transistor (FinFET). In another embodiment, the DP SRAM cell 100 includes planar field effect transistors (FETs). The DP SRAM cell 100 includes cross-...

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Abstract

The present disclosure provides a static random access memory (SRAM) cell. The SRAM cell includes first and second inverters cross-coupled for data storage, each inverter including at least one pull-up device and at least two pull-down devices; at least four pass gate devices configured with the two cross-coupled inverters; at least two ports coupled with the at least four pass-gate devices for reading and writing; a first contact feature contacting first two pull-down devices (PD-11 and PD-12) of the first inverter; and a second contact feature contacting second two pull-down devices (PD-21 and PD-22) of the second inerter. The invention further provides a dual-port SRAM connection structure.

Description

technical field [0001] The present invention relates generally to the field of semiconductor technology, and more particularly to SRAM cell structures. Background technique [0002] In deep submicron integrated circuit technology, embedded static random access memory (SRAM) devices have become popular storage units for high-speed communications, image processing, and system-on-chip (SOC) products. For example, dual-port (DP) SRAM devices allow parallel operations such as IR (read) 1W (write) or 2R (read) within one cycle, and thus, have higher bandwidth than single-port SRAM. In advanced technologies with reduced feature size and increased packing density, low loading and high speed of cell structures are important factors in embedded memory and SOC products. Various gate structures are realized to achieve high packing density and high speed. For example, a U-shaped gate structure is adopted in the SRAM structure. However, U-shaped gate structures include potential issues...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/413
CPCG11C8/16H10B99/00H10B10/00G11C11/419G11C11/412G11C11/4125
Inventor 廖忠志
Owner TAIWAN SEMICON MFG CO LTD
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